Technologist, Packaging Engineering

Company Description

At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.

At our core, Western Digital is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we’ve been doing just that. Our technology helped people put a man on the moon.

We are a key partner to some of the largest and highest growth organizations in the world. From energizing the most competitive gaming platforms, to enabling systems to make cities safer and cars smarter and more connected, to powering the data centers behind many of the world’s biggest companies and public cloud, Western Digital is fueling a brighter, smarter future.

Binge-watch any shows, use social media or shop online lately? You’ll find Western Digital supporting the storage infrastructure behind many of these platforms. And, that flash memory card that captures and preserves your most precious moments? That’s us, too.

We offer an expansive portfolio of technologies, storage devices and platforms for business and consumers alike. Our data-centric solutions are comprised of the Western Digital®, G-Technology™, SanDisk® and WD® brands.

Today’s exceptional challenges require your unique skills. It’s You & Western Digital. Together, we’re the next BIG thing in data.

Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Represents Package Engineering in cross-functional teams and ensures that packages are characterized, qualified, and introduced into production in a timely manner while meeting all mechanical, electrical, performance, reliability, and quality requirements.        
• Working with cross-functional teams, factories, and other engineers, manages the entire package life cycle process.          
• Coordinates with factories and contract manufacturers worldwide on the high volume introduction of new packages and assembly processes.           
• Works with the Packaging R&D teams worldwide to develop and qualify new and emerging packaging technology required to support business needs
• Manages assembly yield improvement and package cost reduction programs  
• Responsible for maintaining package roadmaps, budgets for the product lines supported and building packaging infrastructure 
• Lead new product from low volume to high volume production transition with yield and quality meeting goals. Ensure FMEA, SOD, Control Plan, recipe guideline, SPC and other assembly controls are ready prior to high volume production.
• Collaborate extensively with internal teams, validate design options through characterization builds, perform comprehensive DFX (Design for exellence) analysis, including DFM (Design for Manufacturability), DFA (Design for Assembly), DFRW (Design for Rework

Qualifications

• Master’s degree or PhD in Material Science, Manufacturing, Mechanical Engineering, Computer Science, Physics or other engineering disciplines.
• Master’s degree with more than 10 years of relevant work experience, or PhD degree with over 8years of work experience.
• Proficient understanding of packaging domains such as SMT, PCBA, solder joint reliability, board level reliability, packaging materials, failure analysis, and PCB layout. Additional knowledge in areas like die attach, wire bond, wafer thinning, and molding is a plus.
• Experience in Machine learning and data analytics utilizing AI is a plus.
• Exceptional problem-solving skills with expertise in experimental design and statistical analysis.
• Excellent written and communication skills, enabling collaboration with global functional teams.
• Knowledge of thermo-mechanical aspects of semiconductor packages and Solid-State Drives
• Constantly track major industry benchmark announcements as it relates to packaging and proactively build awareness of key benchmark strategies.
• Assist in developing and maintaining the Package Technology Roadmap, working with global assembly, and packaging teams.
• Analyze Package technology roadmaps based on industry benchmarking trends and highlight any emerging gaps and actions needed.
• Experience in mentoring or managing junior engineers is a plus.

Additional Information

Western Digital is committed to providing equal opportunities to all applicants and employees and will not discriminate based on their race, color, ancestry, religion (including religious dress and grooming standards), sex (including pregnancy, childbirth or related medical conditions, breastfeeding or related medical conditions), gender (including a person’s gender identity, gender expression, and gender-related appearance and behavior, whether or not stereotypically associated with the person’s assigned sex at birth), age, national origin, sexual orientatio