Space Electronics Packaging and Mechanical Product Design and Analysis Engineer - (Experienced or Lead)

Space Electronics Packaging and Mechanical Product Design and Analysis Engineer - (Experienced or Lead)

Company:

The Boeing Company

Job ID:

00000437371

Date Posted:

2024-08-27

Location:

USA - El Segundo, CA

Job Description Qualifications:

Boeing Space, Intelligence & Weapons Systems is currently hiring a Space Electronics Packaging and Mechanical Product Design and Analysis Engineer to join us as part of our Electronics Packaging and Product Design Team located in El Segundo, CA.

We are seeking exceptional Mechanical Engineers with a passion for innovation to join our team and become part of something truly remarkable. As a Space Electronics Packaging Design and Analysis Engineer, you will play a pivotal role in shaping the future of space exploration with us.

We offer an unparalleled opportunity to be part of a team that conducts full in-house cradle-to-grave work, providing you with a unique and fulfilling experience. From the moment you step through our doors, you will have the chance to contribute to every stage of the product lifecycle, from initial design concepts to prototyping and final production. This includes mechanical PCB design, Electronics Packaging, and Thermal/Structural/Vibration Analysis.

You will be at the forefront of satellite missions, unlocking new frontiers in space exploration. In addition, you will have the opportunity to work on projects involving multichip modules, microelectronics, electronic systems, and much more. The breadth of our work while working alongside world-class engineers and mentors, will inspire and guide you and challenge you to expand your skillset and delve into fascinating new areas, making every day a thrilling adventure.

To further enhance your experience, our on-site satellite factory is at your disposal, enabling you to unleash your creativity and expertise while delivering solutions at the highest level of excellence. This proximity allows for seamless collaboration with satellite engineers, giving you firsthand knowledge of the intricacies and complexities of satellite missions. By working closely with experts in the field, you will contribute to the seamless integration of our electronics packaging solutions, ensuring they meet the rigorous demands of the space environment.

Develop your technical competence as well as your leadership skills at a company with huge potential for long-term career growth. We’re highly supportive of innovative thinking, we respect and acknowledge hard work, we recognize maturity and integrity, and we reward bottom-line achievement. #TheFutureIsBuiltHere

Position Responsibilities:

• Resolves complex issues on critical programs related to architectural approaches, requirements, specifications and design.

• Leads technical aspect of proposal preparation.

• Identifies critical performance measures and develops processes for computing them.

• Leads activities in support of Supplier Management with make/buy recommendations and other technical services.

• Coordinates engineering support throughout the lifecycle of the product.

• Develops new concepts for future product designs to meet projected requirements.

• Recommends and manages technology insertion.

• Works under consultative direction.

This position is expected to be 100% onsite. The selected candidate will be required to work onsite in El Segundo, CA.

This worksite participates in Boeing’s optional 9/80 schedule rotation. 9/80 is a rotation in which employees can work 9-hour shifts, 8 days per pay period (bi-weekly) and receive every other Friday off.

Some positions may require up to 20% travel domestically and/or internationally depending on business requirements.

This position requires the ability to obtain a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim and/or final U.S. Top Secret, or Top Secret SCI Clearance Post-Start is required (based on the position selected for).

Basic Qualifications (Required Skills/Experience):

• Bachelor of Science degree from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), chemistry, physics, mathematics, data science, or computer science

• 3+ years of experience utilizing Computer-Aided Design (CAD) tools

• 3+ years of experience with electronic packaging or product design and analysis

• Either: 3+ years of experience with thermal, structural, dynamics, and/or vibration analysis and tools