Job Details:

Job Description: 

Join the Quality and Reliability team that is working on leading edge of Logic technology!

Responsibilities may include but not limited to:

• Performs feasibility studies and provides integrated process solutions to meet desired safety, quality, reliability and output requirements for ultimate transfer to high volume manufacturing.
• Selects and develops material and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Plans and conducts experiments to fully characterize the process throughout the development cycle and to improve performance for each specific product.
• Identifies integrated process solutions to resolve issues or specific requests from customers by partnering with innovators in product engineering and module engineering teams.
• Conducts new product qualification and technology transfers from fabrication operations.
• Leverages big data analysis to identify process design weaknesses and/or manufacturing tool issues and proposes corrective, databased solutions.
• Collaborates and engages with development and material suppliers, and partners to develop processes and equipment needs to meet technology roadmaps.

Qualifications:

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

Must have a Master's degree in Electrical Engineering, Material Science, or related field with 10+ years of experience or a Ph.D in the same fields with 6+ months of experience.

Specific Experience Areas include:

Semiconductor device fabrication.

Semiconductor device characterization.

Experimental design execution and interpretation.

Preferred Qualifications:

Experience in a range of analytical techniques and acoustic profiling.

Background in semiconductor device physics interconnects Reliability.

Understanding of reliability failure statistics physics or failure mechanisms.

Experience in thermal and electrical electron transport.

          

Job Type:

College Grad

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Oregon, Hillsboro

Additional Locations:

Business group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits:

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation.  Find more information about all of our Amazing Benefits here:  https://www.intel.com/content/www/us/en/jobs/benefits.html

Annual Salary Range for jobs which could be performed in the US:

$105,797.00-$175,105.00

Salary range dependent on a number of factors including location and experience.

Work Model for this Role

This role will be eligible for our hybrid work model which allows empl