Advanced Packaging Technology Program Manager

As an Advanced Packaging Technology Program Manager, be part of an exciting team working on cutting-edge advanced packaging process technologies. To oversee the development and validation of module process and integration the solutions to enable advanced packaging process technologies in the world of mobile, IoT, consumer and high-performance computing area. Work with various teams from inside and outside of Applied Materials to help develop leading-edge packaging solutions for our partners taking them from concept to mass production. Responsibilities will include conducting program management, execute gap-analysis, risk-assessment and mitigation, and monitor and track integration process flow development to make sure projects are completed successfully and delivered on time.

Responsibilities:

• Manage complex technical programs and teams leading to timely development of products/process capabilities.

• Build up advanced 2.5D and 3D SiP MEOL and assembly flows

• Drive relevant work on developing assembly process technologies for advanced System-in-Package, RDL, Hybrid Bonding and Heterogeneous Packaging solutions

• Ensure proper module process, measurement & inspection to validate each process in integration

• Drive and develop process design kit (PDK) components to include various packaging processes

• Interface with internal module process development, layout, package architecture, package design teams and with external suppliers, foundries, and OSATs for the development and realization of advanced packaging solutions

Requirements:

• Master Degree or Bachelor Degree in Electrical, Mechanical, or Materials Science Engineering

• Minimum 8 years of experience in semiconductor packaging/assembly/BEOL and minimum 5 years of program management role

• Experience with Die and Wafer level Bonding processes

• Good understanding on Advanced Packaging architecture and process flow

• Relevant experience on MEOL & Packaging Assembly unit Process (Reconstitution, Litho, Etch, CVD, PVD, Plating, Back Grinding, Dicing, Molding, P&P, Bonding etc.)

• Experience and Knowledge on various packaging technologies such as wire-bonding, flip-chip, TCB, camera-module assembly, molding, singulation, WLCSP, MCMs, and SiP

• Good understanding on enabling high-density interconnects, associated mechanical, thermal and reliability issues and cost tradeoffs of various interposers process technologies

• Good understanding on design manual, design rules, generation rules, parasitic extraction and PDK development associated workflow

• Willing to tackle tough problems and enjoys problem solving. Comfortable in large corporate environments and can work with multi-functional teams across geographies

Qualifications

Education:

Bachelor's Degree

Skills

Certifications:

Languages:

Years of Experience:

4 - 7 Years

Work Experience:

Additional Information

Travel:

Relocation Eligible:

No

Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.