Semiconductor Backside Via Process Lead

Date Posted:

2025-05-08

Country:

United States of America

Location:

MA102: Andover MA 362 Lowell Plymouth 362 Lowell Street Plymouth, Andover, MA, 01810 USA

Position Role Type:

Onsite

U.S. Citizen, U.S. Person, or Immigration Status Requirements:

The ability to obtain and maintain a U.S. government issued security clearance is required.​ U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance

Security Clearance:

DoD Clearance: Secret

At Raytheon, the foundation of everything we do is rooted in our values and a higher calling to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world.  

Job Summary:

An exciting opportunity exists at Raytheon for a Semiconductor Backside Via Process Lead to join our III-V compound semiconductor foundry team fabricating gallium nitride and gallium arsenide-based devices within the Advanced Microelectronics Solutions (AMS) Department.  This role requires a broad understanding of microelectronics processing and subject matter expertise in one or more backside via process related techniques including photolithography, sputtering, Dry Etch, and Electro-plating.

As a member of the AMS Department, the individual in this role will serve as the backside via process lead engineer and collaborate with the various engineering work centers in the III-V semiconductor wafer foundry.  The candidate will lead and assist projects in process sustainment, capital allocation, directing process and capital qualifications, improving cycle time, improving product yield, developing new data driven controls, and driving overall wafer movement efficiency. 

The chosen candidate is expected to be an innovative and creative thinker capable of probing issues and reaching solutions both independently and in a team environment. The ideal candidate will have working knowledge of various microelectronics processing techniques beyond deposition, including wet and dry etching, lift-off techniques, photolithography, metrology, process characterization, foundry data integrity, and large data analysis methods.

The candidate is expected to work well in large and small, cross-functional teams, understand foundry processes, determine capacity limitations, improve overall equipment effectiveness, identify yield improvement opportunities, gather sponsorship and team resources, and execute on continuous improvement activities. Presence on the foundry floor is essential for quick resolution of technical issues as well as the ability to work with operations, facilities, equipment, and quality teams.  The role requires a large degree of multitasking with attention to detail while managing priorities depending on the nature of the problems and the commitments.

This role will be 100% on-site and based in Andover, MA.

What You Will Do:

• Sustainment of current deposition production processes and involvement with development of new process
• Set and report center priorities at the 8am foundry tier meeting
• Identify process improvement opportunities
• Lead 8Ds and RCCAs
• Create, document, maintain and approve work instructions
• Assist process engineers in training users and operators on semiconductor processes and equipment
• Manipulate large datasets and use statistical analysis to define SPC controls, manage projects, and assign risk
• Develop and report on actionable deposition work center health metrics
• Identify capital needs, collaborate with tool vendors, assist in tool acceptance, and create plans/schedules for tool and process qualifications
• Frequently work on the foundry floor and interact with various process engineering, equipment engineering, digital technologies, quality, facilities, and operation teams

Qualifications You Must Have:

• Typically requires a degree in Science, Technology, Engineering or Mathematics (STEM) and a minimum of 8 years of prior relevant experience, or an advanced degree in a related field and minimum 5 years’ experience in Engineering/other technical positions.
• Experience in semiconductor processing techniques including photolithography, dry etching, metals evaporation, and optical or scanning electron microscope inspections
• The ability to obtain and maintain a US security clearance. U.S. citizenship is required as only U.S. citizens are eligible for a security clearance.

Qualifications We Value: