Advanced Packaging Process Development Engineer - Staff

Bold Thinking. World Changing. At SkyWater, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life-saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters, Florida, or Texas location — employees join together to improve the world.


Explore what’s possible. Joining our U.S. - based team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning “science fiction” into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies. We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few. Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services.


Step into the future. SkyWater’s values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment. We also invest in developing highly skilled, dedicated employees — and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds.


Are you bold thinking? Find your place on our team and help us change the world!


Position Summary:
As an Advanced Packaging Process Engineer, you will own all assigned process steps. The preferred candidate will have the ability to troubleshoot difficult and poorly defined problems in relation to the specific process disciplines assigned using tool knowledge/experience, SPC, qualifying data, and other available resources. The candidate will have extensive collaboration with the area maintenance team and equipment engineering. Some collaboration will be with tool vendors, other area engineers/managers, procurement, integration, and production. If you are a self-motivated team player, who thrives in a fast-paced, constantly changing environment, passionate about building great products and learning new technologies, this is the job for you!
Major Areas of Accountability:
• Provide technical leadership and management of Advanced Packaging Semiconductor processes in Support of Fan Out Wafer Level Packaging, Interposers, Hybrid Wafer to Wafer bonding, and Die to Wafer Bonding. Highly desirable for a candidate to have a background in at least one of the following areas: Wafer Singulation, Solder Bumping, Maskless Photolithography, PVD and/or CVD Thin Films, Dry Etch, Wet Etch /Wafer Clean, Diffusion, Bond, Electroplate (ECD), CMP, or Metrology, Probe/Test (some areas may be combined).
• Work with equipment engineering and equipment maintenance technicians to drive root cause corrective actions of equipment failures, implement permanent solutions, and eliminate chronic and long-term down events.
• Collaborate with continuous improvement teams to drive tool matching, availability, throughput improvements and reduce risk.
• Management of new tool qualifications to increase fab capability, capacity, lower costs and improve yields.
• Work with minimal supervision, balancing competing priorities, to serve the needs of the Maintenance, Production, and Development organizations.
• Participate in cross-functional teams that create efficiencies across all layers of the organization.
• The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.
Required Qualifications
• Education: BS Engineering (4 years exp.), MS/PhD preferred (2+ years exp.) in Materials Science, Physics, Electrical or Chemical Engineering or other relevant Engineering disciplines.
• Proven understanding of assigned process steps and interrelation to previous and subsequent process steps in the Semiconductor manufacturing and Advanced Packaging fields.
• Experience with application of structured problem-solving methodology.
• Prior experience with Die Attach, Pic & Place, Thermal Compression Bonding, Hybrid Bonding, Compression Molding, Wafer Singulation, Grinding and Micro Ball Attach / Reflow.
• Positive interpersonal skills, highly energetic and self-motivated.
• Experience Creating and Managing Process steps.
• Strong Experience with set up and use of SPC Charts.
• Experience with Advanced Process Control Systems (APC).
• High level of understanding of equipment process behavior.
• Experience Integrating MES Software.
• Proficiency with analytics Software programs such as JMP and MATLAB.
• Demonstrated ability to meet requi