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Principal Electrophysics Engineer/Scientist

Boeing
El Segundo, United Statesfull_timeVerifiedPosted 28 Jun 2024
💰 $257,600/yr($190,400/yr$257,600/yr)

About the role

Principal Electrophysics Engineer/Scientist

Company:

The Boeing Company

Job ID:

00000416471

Date Posted:

2024-06-28

Location:

USA - El Segundo, CA, USA - Huntington Beach, CA

Job Description Qualifications:

Within BR&T's Mission Systems Technologies (MST) organization, Boeing's Advanced Computing Technology (ACT) team performs innovation, development and maturation of Advanced Computing and it's associated subordinate technologies. This team is looking for a Principal Electrophysics Engineer/Scientist to be based out of El Segundo, CA and Huntington Beach, CA. This position will require travel 25% - 50% travel.

We are Boeing Research & Technology (BR&T) Boeing's global research and development team creating and implementing innovative technologies that make the impossible possible and enabling the future of aerospace.  We are engineers and technicians, skilled scientist and bold innovators.  Join us and put your passion, determination, and skills to work building the future! #TheFutureIsBuiltHere #ChangeTheWorld

Position Responsibilities:

  • Be a strong natural leadership style that moves people to act, motivates and inspires excellence and innovation.

  • Be a prudent change agent, able to quickly assimilate to this new organization effectively.

  • Must be results-oriented with a focus on performance. Demonstrated track record of meeting or exceeding targets goals and strong skills in execution to schedule.

  • Articulate, persuasive, and able to build confidence with both the technical and management team.

  • Proactively and quickly makes sense of complex issues; responds effectively to complex and ambiguous situations; communicates complicated information simply.

  • Gains others' trust by demonstrating openness and honesty, behaving consistently, and acting in accordance with moral, ethical, professional, and organizational guidelines.

  • Participate in development of strategies and roadmaps - technical and business (e.g. new technology areas, partnerships, make/buy trades), create and brief the related materials to senior Boeing management, customers and partners.

  • Meet regularly with customers (external & internal, current & prospective) and partners to shape business opportunities by: 1) understanding our customers’ technical needs & budget plans; 2) understanding our partners’ technical capabilities & roadmaps; and 3) share capabilities, accomplishments, and roadmaps with customers & partners.

  • Build yield models based on process variation and sensitivity of the circuits

  • Skill and ability to: collect, organize, synthesize, and analyze data; summarize findings; develop conclusions and recommendations from appropriate data sources.

  • Advanced knowledge of design concepts and techniques (e.g., concurrent engineering, Design for Manufacture/Assembly [DFM/A]).

  • Knowledge of responsibilities and tasks performed by various Engineering departments/disciplines (e.g., design, test, software, technology, avionics). Knowledge of the interaction between departments/disciplines and how their products/processes affect one another and impact non-engineering processes (e.g., Operations, Logistics, Business).

  • Knowledge of various engineering disciplines such as electrical, mechanical, and systems. The ability to communicate with technical personnel from multiple skill areas and functions to evaluate technical information and issues impacting design, production, and support of products, services, or other deliverables.

  • Ability to understand the big picture and the inter-relationships of all positions and activities in the system, including the impact of changes in one area on another area. This includes the ability to see and understand the inter-relationships between components of systems and plans, anticipate future events, and apply the principles of systems thinking to accelerate performance.

Additional Details:

  • Be the primary technical Liaison between the design and fabrication teams that are developing new semiconductor circuits, processes and products

  • Work with Foundry partner(s) to understand capabilities and limitations of their tools, processes and procedures required to fabricate designs

  • Work with Design team to understand the criticality of each of the design features

  • Analyze foundry process data for each processing step to understand process variability

  • Work with foundry to determine process changes to improve processes to the point where thy support the

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Company

Boeing

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