Liquid Cooling Solutions New Product Introduction Expert Engineer

Liquid Cooling Solutions New Product Introduction Expert Engineer

Description -

This is an Expert level Product Engineering position within HP’s liquid cooling solutions business in the Microfluidic Technology Organization (MTO).  Our technology includes the merging of complex design constraints, the use of material combinations and extensive product testing/qualification to deliver high quality products that provide excellent end user performance.   This includes the combination and interaction of polymers, ceramics, metals, elastomers, multilayer films and electronics using mechanical, fluidic, electrical, adhesion, thermal and chemical manufacturing processes.  Integrating components manufactured in silicon wafer fabrication, printed circuit board assembly, and other unique to HP processes.  A product engineer monitors this process to ensure product requirements are met or exceeded. 

Responsibilities:

• Understand customer (product) and manufacturing (process) requirements.
• Assist with Design for Manufacturability (DFM) and Development Effectiveness in new product development to reduce risk at launch of new products.
• Lead key initiatives to solve issues or reduce risks caused by new technologies or processes. 
• Develop and characterize test methods to minimize or eliminate those risks and ensure the product meets the end-customer requirements.
• From characterization and test results, refine specifications end-to-end (product to process) to ensure a shippable product.
• Lead efforts to ensure the high volume manufacturing line is properly aligned with the needs of product design.
• Lead in the acceptance and transfer activities for new products from proto development to high volume manufacturing.
• Lead teams that drive root cause evaluation and issue resolution as problems arise in proto and production.
• Support the efforts of other key organizations such as the Fab, equipment/ tooling design teams, product engineering and printer teams.
• Deliver clear documentation, reporting and communication of your work.
• Partner with other organizations to drive product investigations/issue escalations for released products. 
• Manage qualification of change of the released product.

Education and Experience:

• Education: Bachelor's or Master's degree in Mechanical, Electrical, Chemical or Materials Engineering.
• 10+ years’ experience in a product or process development or production environment.
• Desired: experience in complex printed circuit board and/ or GPU board manufacturing

Required Skills:

• Experience in design of experiments and failure modes and effects analysis.
• Understanding of various root cause evaluation methods (e.g., Kepner Tregoe, fishbone diagram, mind map, etc.).
• Knowledge of different issue resolution methods (e.g., 8D, CLCA, etc.) and how to effectively implement.
• Familiarity in mechanical design and its impact on material and joint design.
• Managing product quality in the factory including the role and use of SPC.
• Ability to create test methods and implement audits for product validation.
• Basic knowledge of 3D Creo with intermediate knowledge of 2D Creo and how to change/modify/update drawings.
• Ability to broadly contribute in a fast-paced, industrial R&D environment.
• Excellent communication and teamwork skills.
• Excellent planning, organizational, and documentation skills.
• Ability to give clear and effective presentations to inform and persuade peers and managers.

The pay range for this role is $116,150 to $182,400 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.

Benefits:

HP offers a comprehensive benefits package for this position, including:

• Health insurance
• Dental insurance
• Vision insurance
• Long term/short term disability insurance
• Employee assistance program
• Flexible spending account
• Life insurance
• Generous time off policies, including;
• 4-12 weeks fully paid parental leave based on tenure
• 11 paid holidays
• Additional flexible paid vacation and sick leave (US benefits overview)

The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice