Process Engineer, Chemical and Mechanical Polish (CMP)

Description

General Function:

The Chemical and Mechanical Polish (CMP) Process Development Engineer is responsible to help support the development of manufacturable, repeatable, and high yielding processes for state-of-the-art highly specialized devices in the fields of Aerospace, Defense, Bioelectronics, and High-Speed Communications. The CMP Process Development Engineer must have a very hands-on mindset and be an excellent communicator. Furthermore the candidate must have an engineering degree (MS or PhD) and a broad knowledge in either Electrical Engineering, Material & Science or Chemistry.

This is a rare opportunity to develop Semiconductor Engineering skills with a highly motivated, high performance technical team on highly differentiated, and disruptive technologies.

Position’s Purpose:

The candidate will provide technical and sustaining engineering support in both development and manufacturing areas. The CMP Process Development Engineer will also recommend and implement equipment and process modifications to improve production efficiencies, manufacturing techniques or production yields for existing products.

The candidate will develop and conduct statistical analysis, such as Design of Experiments (DOE) or Statistical Process Control (SPC), targeting physical cause of failure for yield loss and improving quality. The CMP Process Development Engineer will interact with Senior Process Development Engineers, Product Design and Process Integration personnel to ensure that processes and designs are compatible.

Over a short period of time, the candidate must have the ability to develop a strong understanding of all major process modules (mostly in Cu polish, Ta polish, W polish, Glass polish, SiO2 Polish, Si and amorphous polish, and polyimide polish, including post polish slurry surface cleaning with either system integrated wafer scrubbers and off-line wafer scrubbers, etc).

The CMP Process Development Engineer must also be able to understand and protect both customer and Skorpios IP while simultaneously developing new IP. The candidate is expected to work collaboratively with Skorpios’ Integration team, Operations team, Maintenance team, and Development team in order to execute project plans and complete company deliverables.

Requirements

Key Tasks, Duties and Responsibilities:

• 30% Work closely with Senior Integration Engineers, Customers, and Other Development Engineers to execute experiments, and adjust or optimize processes during our 24/7 Fab Operation. Partner with Product Engineering and Integration to help ensure effective new products and process introductions as well as consistent device performance and quality. Assist Process Technicians through challenging process steps. Help analyze metrology results and disposition lots based on data and pass/fail criteria. Report results to Integration Engineering Team and Process Development Engineering Team. Provide effective pass-downs to help sustain uninterrupted operations in the CMP area.

• 30% Sustain and improve processes for wafer fabrication. Interface equipment engineering, operation, and management to improve cycle time, tool availability, quality and product yields. Preserve working knowledge of all codes and standards applicable to assigned production equipment. Assure that the manufactured products conform to specifications and application requirements. Communicate with Senior Development Engineering team and Integration teams to resolve deviations or technical issues. Sustain existing processes in the areas of, dielectric CMP, Silicon and Amorphous Silicon CMP, Cu CMP, Ta CMP, W CMP, Polyimide CMP, and all post-CMP cleaning or scrubbing techniques required to ensure wafers are free of slurry / particles once the polish process is completed.

• 20% Create and maintain operating specifications for production processes and equipment. Drive innovation and continuous improvement in a fast-paced, dynamic environment.

• 20% Monitor process health with Statistical Process Control (SPC) and respond to out-of-control event following out-of-control action plans.

Basic Minimum Requirements:

Education and Experience:

• Ph.D. or Master’s Degree in Science with emphasis/majors in the fields of Electrical Engineering, Material & Science, Physics or Chemistry. Equivalent expertise with industry related experience is also adequate for the position.

• Individuals with advanced degrees and experience in a development environment are welcomed to apply.

• Processing experience in a lab or a fab in the areas of Chemical and Mechanical Polish, and post-polish wafer surface cleaning is a must. Processing experience with Cu plating is a plus.

Requirement