Senior Technologist, Advanced Package

Please Note:

To provide the best candidate experience amidst our high application volumes, each candidate is limited to 10 applications across all open jobs within a 6-month period. 

Advancing the World’s Technology Together

Our technology solutions power the tools you use every day--including smartphones, electric vehicles, hyperscale data centers, IoT devices, and so much more. Here, you’ll have an opportunity to be part of a global leader whose innovative designs are pushing the boundaries of what’s possible and powering the future. 

We believe innovation and growth are driven by an inclusive culture and a diverse workforce. We’re dedicated to empowering people to be their true selves. Together, we’re building a better tomorrow for our employees, customers, partners, and communities.

What You'll Do
As a Senior Advanced Package Technologist, you will serve as the primary technical bridge between our strategic customers and our internal engineering teams. Rather than focusing on hands-on process development, you will lead technical strategy to define the future of Datacenter SoC packaging. You will be responsible for interpreting complex customer requirements, driving the technical roadmap for advanced packaging (2.5D/3D) and Chiplet architectures, and ensuring that our solutions align with the performance demands of next-generation AI and HPC infrastructure.

Location: Daily onsite presence at our San Jose headquarters in alignment with our Flexible Work policy.

Reports to: Head of Custom SoC Solutions Team

Req: 42813

• Lead Customer Technical Engagement: Serve as the technical authority in meetings with Tier-1 datacenter customers; address requirements for interconnect bandwidth, power efficiency, and thermal management.
• Translate Requirements to Execution: Deconstruct high-level customer product visions into actionable engineering specifications. Define technical requirements for HBM integration, fine-pitch micro-bumps, and advanced substrate technologies for internal development teams.
• Drive Technology Roadmaps: Evaluate and influence the long-term Advanced Packaging roadmap. Assess the feasibility of emerging technologies—including Hybrid Bonding, Co-Packaged Optics (CPO), and Optical I/O—specifically for the Datacenter SoC market.
• Strategic Project Leadership: Lead the technical lifecycle of packaging projects by identifying bottlenecks, proposing performance-cost trade-offs, and ensuring cross-functional alignment.
• Collaborative Architecture Review: Partner with SoC Architects, Signal/Power Integrity (SI/PI) teams, and Foundry/OSAT partners to ensure package designs support high-speed data transmission and high-power delivery.
• Complete other responsibilities as assigned.

What You Bring

• Educational Foundation: Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field with 10+ years of experience; or a Master’s Degree with 8+ years; or a PhD with 5+ years of industry experience.
• Industry Expertise: 7+ years of experience in semiconductor packaging, specifically within the Datacenter or HPC ecosystem.
• Advanced Packaging Knowledge: Deep architectural understanding of 2.5D/3D integration, Chiplets, HBM, and TSV technologies, including the challenges inherent in large-die, multi-chip modules.
• Strategic Technical Influence: Proven experience in a technical marketing, applications engineering, or architectural role where you have influenced product roadmaps and managed high-stakes technical relationships.
• Operational Awareness: Ability to balance cutting-edge technical possibilities with business realities such as time-to-market, yield optimization, and supply chain constraints.
• Communication: Exceptional verbal and written communication skills, with the ability to distill complex technical concepts for both executive and engineering audiences.
• You’re inclusive, adapting your style to the situation and diverse global norms of our people.
• An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.
• You’re collaborative, building relationships, humbly offering support and openly welcoming approaches.
• Innovative and creative, you proactively explore new ideas and adapt quickly to change.

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What We Offer
The pay range below is for all roles at this level across all US locations and functions. Individual pay rates depend on a number of factors—including the role’s function and location, as well as the individual’s knowledge, skills, experience, education, and training. We also offer incentive opportunities that reward employees based on individual and company pe