Technical Project/Program Management Director

Who We Are

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.

What We Offer

Salary:

$172,000.00 - $237,000.00

Location:

Santa Clara,CA

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. 

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. 

Role Summary 

The Technical Program Manager (TPM) Director will serve as the central orchestrator of large, complex module programs spanning Logic and Memory business units and key strategic customers (e.g., Samsung, SK Hynix, Micron, Intel). This role requires a unique blend of technical depth in semiconductor process technologies, business acumen, and executive-level communication to drive program execution from concept through high-volume manufacturing enablement. The TPM will be the binding force across engineering, business development, CTO, and customer organizations — ensuring alignment, speed, and accountability at every stage. 

Key Responsibilities 

• Customer Program Ownership: Lead end-to-end program management for strategic customer engagements, including Technology Review Meetings (TRMs), yield improvement task forces, and cost reduction initiatives. Own program scoping, planning, risk management, and execution to plan of record. 

• Executive Stakeholder Management: Prepare and present executive-level materials (slide decks, agendas, executive summaries) for meetings with customer VPs, CTOs, EVPs, and internal senior leadership. Represent Applied Materials with credibility and technical authority. 

• Cross-Functional & Cross-BU Coordination: Drive alignment across multiple BUs (e.g., MDP, Etch, CTO, Logic Modules, Memory Modules), integrated development teams (IDTs), and cross-functional teams (CFTs) through structured weekly and monthly review cadences. 

• Global Team Leadership: Coordinate program execution across US headquarters and international sites (Korea, Japan, Taiwan), managing across time zones, cultural contexts, and customer organizational structures. 

• Risk & Decision Management: Proactively identify, assess, and retire program risks. Lead trade-off assessments and critical-path analysis to drive timely decision-making and escalation. 

• Communication & Program Rigor: Maintain disciplined program cadence with detailed meeting minutes, action item tracking, milestone reporting, and weekly/monthly executive status updates. Ensure transparency on program performance, risks, gaps, and help needed. 

• Business Development Integration: Partner with business development and strategy teams to shape new module engagement opportunities, translate customer requirements into actionable program plans, and align demo/development priorities with business objectives. 

Qualifications 

Required 

• Education: BS/MS in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related semiconductor discipline. PhD preferred. 

• Experience: 12+ years in the semiconductor industry with at least 5 years in technical program management, business management, or engineering leadership roles. 

• Technical Depth: Strong working knowledge of advanced semiconductor process technologies — including but not limited to DRAM, Logic/Foundry nodes, BEOL integration, FEOL device engineering, etch, deposition, and module integration. 

• Customer-Facing Experience: Proven track record of managing programs directly with major semiconductor manufacturers (IDMs, foundries, memory makers) at the VP/Director level and above. 

• Program Management Expertise: Demonstrated ability to manage lar