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Senior Hardware Engineer

Intel
Santa Clara, United Statesfull_timeVerifiedPosted 20 Dec 2024
💰 $203,801/yr($123,139/yr$203,801/yr)

About the role

Job Details:

Job Description: 

The team is seeking an experienced Hardware Designer for the development of PIC sub-system, reference pluggable optical module boards and Optical Compute Interconnect (OCI) test boards to support product development.

The candidate will be expected to collaborate with a cross functional product development team - HW, FW, PIC, EIC, Packaging and thermal, Optics and NPI.

Job Responsibilities:

  • Support and lead hardware design of an optical transceiver and evaluation boards meeting product specifications, including schematic capture, circuit simulation, PCB design guidance, DFM review and design verification testing.
  • Expertise in designing 100G/lane and 200G/lane module PCBA, own the schematic and layout execution, require extensive experience with designing PDN for high-speed DSP, RFICs, manage PI and SI requirements, actively guide layout engineer, and manage tradeoffs in design.
  • Extensive experience with selection of DSP, Driver, TIA, uControllers, DACs, ADCs, Voltage regulators, etc.
  • Key contributor to Product Requirements, Owns PCBA design from concept phase to full final design and EVT/DVT phase of the product.
  • Understand electrical and optical requirements and specifications of optical transceiver MSA. Like 800G DR8/2xFR4, 1.6T DR8/2xFR4, 800G LPO, 1.6T LRO etc.
  • Maintain documentation of a hardware design specification, Pass design check list prior to tape out, BOM specifications and work with NPI team to build PCBA.
  • Lead design reviews and present design summary to management, highlight risks with mitigation plans.
  • Interface and work collaboratively with mechanical engineers, optical engineers, Photonics engineer, firmware engineers, process engineers and test engineers.
  • Design and coordinate with PI/SI engineer to simulate high-speed interfaces, RF traces, etc. 100Gbps, 200Gbps NRZ and PAM4 signaling.
  • Interact with program manager, buyer/planner, and suppliers to make sure designed parts are available in a timely manner for build.
  • Troubleshooting and performance optimization of the sub-system/transceiver module board

The ideal candidate will exhibit the following professional traits:

  • Communication and presentation skills.
  • Strong background of digital communication theory
  • Familiarity with industry standards including IEEE Ethernet standards, OIF standards, PCIe standards and various MSAs.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

  • M.S. in Electrical Engineering..
  • 5+ years of HW/circuit design experience

5+ years of experience in:

  • High speed analog and digital circuit design skills and layout with mixed signal designs.
  • Architecting floor plan in layout and able to direct layout engineer with clear design priority
  • High density multiple-layer board design.
  • Working with high volume PCB/substrate fab houses.
  • Thermal and EMI management.
  • Electronics CAD tools and electronic system modeling.
  • Principals of micro-controller and communication protocols such as SPI, I2C, MDIO.
  • Working with AWG, DCAM, VNA/LCA to characterize high speed performance
  • Laboratory optical and electrical measurement skills.

Preferred Qualifications:

  • Ph.D. is considered and asset
  • Knowledge of transceiver electrical design principles, including high speed signal integrity, crosstalk, power integrity, noise, soft start, ESD, FW, testing, etc.
  • Experience working with Marvell, Broadcom, MaxLinear, Credo DSPs in pluggable optical modules.
  • Expertise in RF design using modeling tools such as HFSS, ADS.
  • Experience with optical transceiver test and calibration methodologies.

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location: 

US, California, Santa Clara

Additional Locations:

Business group:

The Data Center & Artificial Intelligence Group (DCAI) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, s

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Company

Intel

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