Sr Director - Analog Design

CA Pay Range (Annual):

$210,000.00 - $390,000.00

At Infinera, your base pay is one part of your total compensation package. Your actual base pay will depend on your skills, qualifications, experience, and location. This role may be eligible for equity grants, discretionary bonuses, or commission payments. The amount of these incentives is based on the terms of the Company’s incentive plans, the Company’s financial performance, and/or individual employee job performance.

Infinera also offers paid leave, medical, 

dental, and vision coverage, 401(k),

life, and disability insurance to eligible employees.

Brief Description:

The successful candidate needs demonstrated ability to lead our SiGe Analog/RF/Mixed-Signal ASIC development team, projects  

and shall possess a broad knowledge in analog & RF circuit/chip design with the focus on high performance, high frequency, and low noise

broadband TX (MZMD), RX (TIA), and other supporting circuits.

He or she should have abundant experience in managing a diverse technical team and bringing innovation to a fast-paced product

environment from definition to design and production.

Essential Functions and Key Responsibilities:

• Lead the Analog/RF ASIC Design Team in defining the product, chip architecture, design, foundry selection/interactions, test and productization.
• Manage and scale the team to deliver Analog/RF ASIC solutions in support of Nokia’s development of optical engines.
• Enhance and rigorously execute on design methodologies and processes to achieve the highest product quality.
• Guide the team in exploring the optimal topology for our applications to enable our products to become market leaders.
• Work with cross-functional teams to understand and define product requirements and plans.
• Lead interactions with internal and external teams and vendors on foundry, packaging, test, and qualification efforts
• In charge of many aspects of IC/Chip product development (spec, design, layout, tape-out, silicon bring-up, test, reliability, etc.)
• Work closely with verification, CAD, product, and test engineering teams to devise and conduct DVT plans and characterization.

Mandatory Knowledge/Skills/Abilities:

• Proven track record of analog/RF/mixed-signal SiGe  BICMOS, CMOS ICs design and productization
• Experienced in managing/leading a diverse team of strong Individual contributors.
• Abundant knowledge in high-speed, high-performance, low-noise Analog/RF circuitry, including low-noise amplifiers, TIA, MZMD, and related functions
• Good understanding of Analog/RF/mixed signal layout techniques and best practices.
• Solid understanding of 3D EM simulation tools (transmission lines and other high-frequency passive structures)
• Knowledge of RF wafer probing, lab equipment, and evaluation of high-speed analog ICs
• Decent knowledge of package and board-level design optimization.
• Fluent in verbal and written communications.
• Independently resolve issues to conquer organizational and technical challenges.
• Self-motivated, self-driven with attention to details.
• Experience leading cross-functional teams with direct people-management responsibilities

Education and Experience Requirements:

M.S. or Ph.D. in E.E. with 15+ years of related experience

“This position requires direct or indirect access to certain confidential information, hardware, software, technology, or technical information (referred to here as “Export-Controlled Information”) controlled under the U.S. International Traffic in Arms Regulations (ITAR) and/or the U.S. Export Administration Regulations (EAR). All personnel in this position must be eligible to or be able to obtain authorization from the appropriate agency to access applicable Export-Controlled Information. The U.S. Department of Commerce currently requires a foreign person with a most recent citizenship or permanent residency of Sudan, Ukraine, or a country currently designated in Country Group