Senior Photonics Packaging Engineer

Your mission

The future of AI computing is light, not electrons. Q.ANT is building photonic processing systems that compute with light – delivering a scalable, energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications.

As Senior Photonics Packaging Engineer (f/m/d), you will lead the specification, development, and verification of high-density photonic packaging solutions that integrate photonic integrated circuits (PICs), light sources, photodetectors, and analog circuitry into production-ready modules. You'll be the technical authority ensuring that supplier-delivered modules meet stringent optical, electrical, thermal, and mechanical requirements through precise definition of technical requirements, contractual agreements, and supplier project management.

What makes this role unique:

• High complexity: Developing novel high-density photonic packaging concepts that simultaneously address thermal management, optical alignment, RF signal integrity, and manufacturability – an area with few industry precedents
• Strategic freedom: Broad autonomy to define requirements, select suppliers, and design technical strategies within strategic goals and budgetary limits
• Decision authority: Direct influence on supplier relationships, product architecture decisions, and program economics
   innovation mandate: Implementation of at least one new packaging material, process, or architecture annually that becomes differentiating IP for the company
• Real-world impact: Your work directly enables technology already deployed in production at world-leading institutions like the Leibniz Supercomputing Centre

Within your first 18-24 months, you will:

• Achieve leading-edge integration density and performance through innovative packaging architectures that enable our photonic processors to deliver up to 30x energy efficiency vs. conventional systems
• Minimize integration risks and rework through rigorous supplier verification and quality assurance
• Contribute to competitive advantage by accelerating time-to-market and optimizing cost-performance trade-offs in the rapidly scaling photonic computing market
   

Key responsibilities:

• Cross-functional leadership: Coordinate internal R&D, system engineering, manufacturing, and test teams to align packaging solutions with overall product architecture
• Supplier engagement & interface role: Act as the primary point of contact for suppliers, ensuring alignment on technical goals, schedules, and deliverables, including contract management and negotiation
• Project control: Plan and oversee multi-party R&D projects, tracking milestones, budgets, and risks, while ensuring deliverables are verified and integrated into final systems
• Technical specification: Define complete packaging requirements, including optical coupling techniques, thermal management strategies, RF signal integrity, and hermetic sealing methods
• Quality assurance: Ensure supplier quality ratings maintain ≥95% on-time delivery with zero critical defects, and packaging costs remain within ±5% of budgeted targets

Your profile

Education & Experience:

• More than 5 years of experience in hybrid packaging, photonics assembly, optoelectronic integration, or related high-density interconnect technologies
• Proven track record in managing supplier-led R&D and packaging projects, from requirements definition through to integration and validation
• Hands-on experience with PICs, laser sources, photodetectors, analog electronics, and mixed-signal integration
• Master's or PhD in Photonics, Optoelectronics, Electrical Engineering, Physics, or a related field

Deep Technical Expertise in:

• Optical coupling techniques (butt-coupling, lens coupling, fiber array integration)
• Thermal man