Senior Manager, ECAD Solutions (Semi Test Engineering; North Reading, MA)

We are the global test and automation specialists, powering next-generation technologies through sophisticated solutions. Behind every electronic device you use, Teradyne's test technology ensures your device works right the first time, every time! Our portfolio of automation solutions help manufacturers to develop and deliver products quickly, efficiently and cost-effectively. Together, Teradyne companies deliver manufacturing automation across industries and applications around the world!

Our Purpose  
TERADYNE, where experience meets innovation and driving excellence in every connection. We are fueled by creativity and diversity of thought and in our workforce. Our employees are supported to innovate and learn something new every day. 
 
We cultivate a culture of inclusion for all employees that respects their individual strengths, views, and experiences. We believe that our differences enable us to be a better team – one that makes better decisions, drives innovation and delivers better business results.

Opportunity Overview

Teradyne is seeking an experienced and driven leader to champion the Electronic Design Automation (EDA) / Electronic Computer-Aided Design (ECAD) department, which encompasses the physical design and layout of Printed Circuit Boards (PCBs), component modeling, signal and power integrity simulation, and EDA tool integration, support, and roadmap alignment with EDA tool vendors. This organization is a key collaborator in the design and development of state-of-the-art electronic test instruments used in semiconductor Automated Test Equipment (ATE).

All About You

We seek individuals who share our passion and determination. Our commitment to customer success drives us to go the extra mile. If you’re ready to join us in this mission, take a closer look at the minimum criteria for the position.

• Own and drive all aspects of Printed Circuit Board (PCB) physical design and development (placement and routing) and advanced electronic packaging for the development of cutting-edge instrument technology.
• Champion the selection and maintain the state-of-the-art capabilities of the organization through the continuous improvement of the tools, technologies, and processes associated with PCB design.
• Assure that the total cost of ownership and ROI of the required tools meets the business needs.
• Keep the organization consistent with the latest tools and best practices.
• Make use of emerging innovations, such as artificial intelligence (AI) and machine learning (ML) for auto place and route, to improve efficiency through reduced development time and cost.
• Drive simulation of designs, including signal and power integrity, to assure that PCB designs meet the design intent with the least number of iterations.
• Manage the development flow to be flexible to meet business needs.
• Maintain strong collaboration with manufacturing, supply chain, and design engineering.
• Ensure seamless integration with adjacent design processes, such as those of our manufacturing partners, supply chain management, PLM system, and other engineering disciplines.
• As a senior leader you will manage a group of managers and individual contributors in multiple geographic locations, with the responsibility of conducting performance reviews, provide constructive and timely feedback, and create career development plans for the engineering staff.
• Manage timelines, budgets, and resources to ensure successful project completion.
• Active and collaborative member of the hardware product engineering leadership team, ensuring that overall business goals are met.

 

The Ideal Candidate Has:

• Strong background in the development of high speed / high frequency, complex PCB designs.
• Strong background with EDA vendors, tools, and the selection and management of such to meet the needs of the business.
• Proficient in the areas of DFM principles, PCB fabrication, and PCB assembly.
• Experience in EN55022 and similar standards that address EMI, EMC, Signal and Power integrity, creepage and clearance, crosstalk and isolation, high speed signal fidelity,