Sr. Mechanical Engineer - Avionics Mechanical Packaging - TeraWave

Application close date:

Applications will be accepted on an ongoing basis until the requisition is closed.

At Blue Origin, we envision millions of people living and working in space for the benefit of Earth. We’re working to develop reusable, safe, and low-cost space vehicles and systems within a culture of safety, collaboration, and inclusion. Join our team of problem solvers as we add new chapters to the history of spaceflight!  

Blue Origin is pioneering the future of space-based communications with TeraWave, a revolutionary satellite communications network designed to deliver symmetrical data speeds of up to 6 Tbps anywhere on Earth. This multi-orbit constellation will consist of optically interconnected satellites in low Earth orbit (LEO) and medium Earth orbit (MEO), providing enterprise-grade connectivity for critical operations worldwide.

As part of the TeraWave Spacecraft Bus Electrical Power Subsystem team, you will be responsible for driving requirements, design, analysis, test, and critical review of avionics enclosures and assemblies which house electronic components. This senior level role requires leadership, expertise, and training for the mechanical team. You will play a key role in developing the TeraWave Satellite system from concept through formal qualification and verification including integration and flight support activities. You will own mechanical packaging for the Power Management and Distribution (PMAD) Line Replaceable Unit (LRU), including enclosure, card retention, thermal paths, connector access, mounting interfaces, serviceability, mass optimization, producibility, and integration flow. Your work will support evolving PMAD architectures.

Responsibilities include but are not limited to:

• Provide leadership as a member of a cross disciplinary team in a fast-paced design environment 
• Participate in the entire design cycle of flight and mission critical avionics 
• Collaborate with customers and stakeholders to define requirements and design architecture
• Collaborate with the electrical engineering team to incorporate printed circuit board and interconnect systems, including thermal and structural analyses of these components 
• Lead design trade studies
• Design avionics enclosure solutions for performance and high reliability in harsh environments
• Create mechanical interface definitions, specifications, and control documents
• Create 3D CAD models and assemblies, part and assembly drawings, installation drawings, and other required technical documentation
• Build and evaluate prototype assemblies
• Create assembly aids and test fixtures
• Collaborate on and document team mechanical best practices
• Plan and conduct engineering tests and data reviews
• Create and deliver presentations, proposals, and training material on technical subjects
• Review assembly instructions and support hardware builds
• Validate requirements through design, test, analysis, and inspection 
• Support Production and Quality Engineering as needed, including dispositioning material defects
• Manage revisions of the product design configurations through the product lifecycle
• Mentor and train junior engineers
• Review and approve designs and documentation created by other team members

Minimum Qualifications:

• B.S. degree in mechanical or aerospace engineering 
• 7+ years of recent experience designing ruggedized electronic enclosures or similar high-performance / high reliability hardware 
• Skilled with static structural, modal, random vibration, and thermal analysis
• Skilled with 3D CAD modeling programs (Creo preferred) 
• Experience with FEA tools (Ansys preferred) 
• Experience with Steinberg or Engelmeier solder fatigue 
• Skilled with GD&T implementation and analysis (ASME Y14.5) 
• History of communicating design concepts and analysis results effectively 
• History of demonstrating autonomous project leadership
• Technical authority has been recognized by the larger organization
• Experience with environmental testing including vibration, shock, thermal cycle
• Experience performing failure analysis and establishing root cause / corrective action

Preferred Qualifications:

• Experience with one or more of the following packaging disciplines: avionics, power regulators and distributors, batteries
• Experience with aerospace, launch vehicle, or spacecraft avionics systems
• Experience with recent versions of Creo, Windchill, Ansys Mechanical
• Experience with fatigue analysis and fracture mechanics
• Experience with aerospace industry standard structural anal