Development Engineer for Assembly and Interconnect Technologies in High-Innovation Optical MEMS Project (f/m/div.)

Company Description

At Bosch, we shape the future by inventing high-quality technologies and services that spark enthusiasm and enrich people’s lives. Our promise to our associates is rock-solid: We grow together, we enjoy our work, and we inspire each other. Welcome to Bosch.

The Robert Bosch GmbH is looking forward to your application!

Job Description

For a high-innovation project in the field of optical microelectromechanical systems (MEMS), we are seeking a development engineer for advanced semiconductor assembly and interconnect technologies that push todays technical limits. You will work with industry-leading machine and material suppliers and assembly partners to develop advanced packaging processes that enable the realization of a completely new class of optical MEMS devices.

• As a development engineer for assembly and interconnect technologies you are part of a packaging experts team within Bosch and our suppliers to develop and characterize new and innovative optical MEMS device packages as well as part of an interdisciplinary product development team with customer representatives, purchasing, MEMS design and technology, reliability, testing, simulation, construction, production and quality team members.
• You are responsible for the material and machine selection and associated process development for core assembly steps required to realize a new optical MEMS module.
• Furthermore you are selecting and qualifying new suppliers (assembly subcons, equipment and raw material suppliers), co-working with equipment suppliers to enhance existing or to develop new machines required to realize the optical MEMS module and visiting suppliers to evaluate their product and technology portfolio and also to manufacture prototypes and customer samples.
• Optimizing the design of key optical MEMS package components based on prototype builds and to take care of the development, qualification and transfer to mass production of new assembly processes and materials are also part of your job.
• Last but not least you are the owner of specifications and technical documentation concerning the optical MEMS package, assembly process, and raw materials.

Qualifications

• Education: completed university studies (master's degree/diploma/PhD) in material or natural science (physics, chemistry), mechanical or electrical engineering or a comparable subject
• Experience and Knowledge: several years of experience in sensors and/or semiconductor package development or related industries, in hermetic packaging, flip-chip-attach, high-I/O interconnect assembly technologies or non-standard wafer singulation preferred, with 3D CAD construction is a plus
• Personality and Working Practice: self-driven and proactive with a strong technical background, a problem solver with broad technical interests, creative, initiative, autonomous, with leadership skills, willingness to travel and you can successfully work on complex technical topics in a large interdisciplinary development team
• Enthusiasm: for technical innovation
• Languages: fluent in English

Additional Information

You want to work remotely or part-time - we offer great opportunities for mobile working as well as different part-time models or job-sharing. Feel free to contact us.

Diversity and inclusion are not just trends for us but are firmly anchored in our corporate culture. Therefore, we welcome all applications, regardless of gender, age, disability, religion, ethnic origin or sexual identity.

Need support during your application?
Jeannette Martins (Human Resources)
+49 711 811 27525

Need further information about the job?
Ronald Gampp (Functional Department)
+49 7121 35 39744

Interested in this or similar positions? Have a look at our Virtual JobFair@BOSCH and get to know our challenging and exciting projects at BOSCH. You will find further information and dates on our website: www.bosch.de/events/