Senior Staff Engineer, RD Packaging & Module Engineering

 

Sense the power of light

The ams OSRAM Group is a global leader in innovative light and sensor solutions. With more than 110 years of industry experience, we combine engineering excellence and global manufacturing with a passion for cutting-edge innovation enabling transformative advancements in the automotive, industrial, medical, and consumer industries. “Sense the power of light” – our success is based on the deep understanding of the potential of light and distinct portfolio of emitter and sensor technologies. Around 19,700 employees worldwide drive innovations alongside societal megatrends.
Find out more about us on https://ams-osram.com

 

The CSA division supplies sensors that bridge the gap between the world we live in and the digital world of machines. By converting physical signals - heartbeats, sounds, light waves - into data, we enable robots, cars and other devices to interact with people and improve our world. What drives CSA is a relentless desire to contribute to technology and have a meaningful impact on the world. This business thrives on solving complex problems and partnering with global leaders at the forefront of technological advancement. Our goal: to push the boundaries of sensor technology and empower innovators to make the world smarter, healthier and happier.

Your new responsibilities

• Lead end-to-end product development from concept, feasibility, design validation, qualification to production ramp
• Mentor junior engineers and provide technical leadership within the team
• Develop and execute prototype build/ new materials characterization, including optical, electrical and mechanical assessment with DOE (Design of Experiment) execution.
• Lead and resolve major issues during project and maintain documentations pertaining to engineering root cause findings
• Collaborate and drive cross functional integration across design process, packaging, test, reliability and production teams
• Analyse parametric and yield data to identify trends and drive root cause analysis. Support yield improvement, failure analysis, and reliability testing activities.
• Create and maintain engineering documentations including BOM, defect catalog, control plans and ERS.
• Drive continuous improvements in development methodologies, cost and cycle time

Who we are looking for

• Degree in Electrical, Electronics, Mechanical, Microelectronics, Materials, Optics or Chemical Engineering
• > 5 years in either R&D, packaging technologies, manufacturing environment
• Experience in sensor module packaging and/or optical engineering will be an advantage.
• Ability to lead/mentor junior team members and providing technical expertise in coaching them

Please contact Soi Kim Kee for further information via suki.kee@ams-osram.com or +65 () 62402395.