Senior Mechanical Engineer

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $12 billion in FY23 and approximately 26,000 people globally working alongside 125,000 global customers, ADI ensures today’s innovators stay Ahead of What’s Possible. Learn more at www.analog.com and on LinkedIn.

The Chip Package Systems Engineering group in Engineering Enablement is looking for a talented and motivated mechanical engineer to join our dynamic engineering team. If you're passionate about semiconductor packaging, mechanical design, and stress simulation, this is an exciting opportunity to grow and make a meaningful impact in a rapidly evolving industry.

As a Mechanical Engineer you will be focusing on Semiconductor Packaging & System Level Stress and Thermal Simulations. You will be part of a team responsible for developing robust and reliable packaging solutions for semiconductor devices and systems. You will work closely with senior engineers to design, simulate, and analyze mechanical structures for advanced semiconductor packaging, with a focus on optimizing for mechanical stress, thermal management, and long-term reliability.

Your responsibilities will include performing stress simulations, designing test structures, collaborating in product development cycles, and applying engineering principles to solve real-world challenges in semiconductor packaging and system level problems.

What You'll Do:

• Stress & Thermal Simulations:
  • Run mechanical and thermal simulations (thermal stress, shock, vibration) using FEA tools to predict semiconductor package performance.
  • Analyze results and collaborate with design teams to improve package reliability.
  • Develop and validate test procedures to confirm simulation accuracy.
  • Perform 3D simulations to assess temperature distribution, thermal gradients, and stress concentrations.
  • Use simulation software (e.g., ANSYS, COMSOL, SolidWorks) to model packaging behavior.
  • Conduct stress analysis, including thermal cycling, to predict failure modes like warping, cracking, or delamination.
• Semiconductor Packaging Analysis & Co-design:
  • Assist in the design, analysis, and development of semiconductor packaging solutions, including materials selection, thermal management, and mechanical performance.
  • Conduct simulations and analyses to assess mechanical stress, thermal behavior, and potential failure points of packaging structures.
  • Collaborate with cross-functional teams to integrate packaging solutions into system-level designs and optimize structures, materials, and interfaces for improved performance and reliability.
  • Support the design and development of packaging solutions for semiconductor devices to validate designs and ensure mechanical stability and thermal efficiency under real-world conditions.
• Collaborative Engineering:
  • Partner with electrical engineers, packaging specialists, and product teams to deliver optimal solutions for complex system integration and performance.
  • Act as a technical resource for manufacturing teams, providing design input to improve efficiency and address production challenges.
  • Support reliability testing efforts, including thermal cycling, shock, and vibration testing, to validate simulations and ensure long-term performance.
  • Support the design and development of test setups to monitor the mechanical and thermal performance of prototypes.
• Documentation & Communication:
  • Prepare and present technical reports on simulation results, design changes, and test outcomes to management and cross-functional teams.
  • Stay up to date on industry trends and tools, while enhancing skills through ongoing training and workshops.
  • Maintain clear and detailed records of engineering design processes, test results, and simulations for future reference.

Who You Are:

• Educational Background:
  • Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, or a related field.
  • Coursework and academic projects related to semiconductor packagin