Principal Package Design Engineer

Company Description

At Renesas, we are more than just a semiconductor company; we are the engine behind a "safer, smarter, and more sustainable" future. Headquartered locally in the heart of San Jose, our Silicon Valley team is at the forefront of innovation in Automotive, Industrial, Infrastructure, and IoT technologies. By blending cutting-edge embedded processing with world-class analog and power expertise, we develop "Winning Combinations" that power billions of intelligent devices globally. Joining our San Jose office means joining a collaborative, forward-thinking environment where your work directly impacts the next generation of AI-driven infrastructure and green energy solutions.

Job Description

Principal Package Design Engineer

Location: Hybrid at main Renesas Electronics America locations (San Jose, CA / Austin, TX)

Department: Semiconductor Power Product Group

Reports To: Senior Principal, Device Design Packaging Technology, Strategy, Operations

Position Summary

We are seeking a Principal Package Design Engineer to lead the development and integration of next-generation packaging solutions for high-performance semiconductors and electronic products. This role will focus on advanced package architecture, assembly processes, thermal and mechanical reliability, and cross-functional collaboration with design, applications, product engineering, manufacturing, suppliers, and quality teams. The ideal candidate has deep expertise in semiconductor packaging technologies and a strong track record of bringing complex products from concept through qualification and high-volume production.

Key Responsibilities

• Lead Advanced Packaging Initiatives: Lead the design, development, and qualification of advanced semiconductor packaging solutions, including:

  • Flip-chip, Chip Embedding

  • Wafer-level packaging (WLP/FOWLP)

  • Panel-level packaging (laminate, molding)

  • 2.5D/3D packaging

  • System-in-package (SiP)

  • Ball grid array (BGA/CSP)

  • Wafer-to-wafer and die-to-wafer heterogeneous bonding

• Architecture & Simulation: Define package architecture based on electrical, thermal, mechanical, reliability, and cost requirements with hands-on, deep simulation expertise.

• OSAT & Vendor Strategy: Drive package technology and OSAT selection and development for new product introductions (NPI).

• Cross-Functional Collaboration: Work closely with IC design, product definers, substrate, board, thermal, reliability, applications, and manufacturing teams to ensure package compatibility and performance.

• Layout & Stack-Up: Oversee package layout reviews, stack-up definition, material selection, and interconnect strategy.

• Simulations & Modeling: Perform and guide others on simulations and analysis related to:

  • Signal integrity / power integrity

  • Thermal performance

  • Mechanical stress / warpage

  • Design for manufacturability (DFM)

• Assembly & Qualification: Develop assembly flows and process requirements for OSATs and manufacturing partners. Lead package qualification activities, including DOE planning, failure analysis, and reliability testing.

• Yield & Issue Resolution: Resolve packaging-related issues and challenges during NPI prototype builds, qualification, and production ramp. Collaborate with suppliers and internal/external manufacturing partners on process improvements, material evaluation, and yield optimization.

• Documentation & Leadership: Create and maintain package specifications, design rules, process documentation, and technical reports. Mentor junior engineers and provide technical leadership across packaging initiatives.

Qualifications

Required Qualifications

• Education: MSc or PhD degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related field.

• Experience: 5+ years of experience in advanced semiconductor packaging or advanced electronics packaging and system integration.

• Technical Depth: Strong hands-on knowledge of advanced packaging technologies, materials, assembly processes, and application system integration as they apply to AI infrastructure and data center power management.

• Reliability & Tools: Deep understanding of thermal, mechanical, and electrical interactions in package design and extensive, hands-on mode