Photonics Integrated Circuit (PIC) Senior Principal Engineer

Date Posted:

2024-06-05

Country:

United States of America

Location:

CA871: Avenue of Science, SD 15110 Avenue of Science Suite 200, San Diego, CA, 92128 USA

Position Role Type:

Onsite

At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world. 

The Systems directorate and Advanced Technology (AT) Programs at Raytheon are seeking a Senior Integrated Photonics Designer with Systems Engineering, Design, and Test experience that is responsible for design, modeling, layout, post-fabrication assembly, sub-system assembly, and benchtop test of RF integrated photonics (PIC) devices/components, subsystems, and systems in support of research and development programs.  They work closely with senior engineers across technical disciplines within Raytheon programs. 

What You Will Do:·         

• Contribute to the design, simulation/modeling, layout, post-fabrication post-processing/assembly, test setup, and benchtop test of integrated photonic components, subsystems, and systems in coordination with senior technical and program leadership. 

• Contribute to selection of COTS/custom photonic (discrete and silicon photonics) components, RF electronics, mixed-signal electronics, and embedded/digital signal processing solutions for wideband electronic and hybrid electronic-photonic development programs. 

• Contribute to architectural trade studies on various systems and sub-systems related to wideband RF and hybrid electronic-photonic components and sub-systems.  

• Contribute to hybrid electronic-photonic sensing requirements development and requirements flow down to the component level. 

• Support the development and implementation of new/novel hybrid electronic-photonic capabilities in close collaboration with other disciplines to provide collaboration and transition opportunities. 

• Contribute to the technical volume for white papers and proposals, as well as contribute to independent research and development (IRAD) projects for the advancement of hybrid electronic-photonics sensors and systems. 

• Be accountable for technical decisions. 

• Communicate and collaborate with Program Management and Technical Leadership, Engineering Leadership, Manufacturing, Suppliers, and Customers. 

• Guide, apprentice, mentor, and train employees within the integrated photonics, RF, electro-optic, packaging, and signal processing technical domains 

• Responsible for providing guidance, coaching / mentoring and training to other employees across the business within area(s) of expertise. 

 

Qualifications You Must Have: 

• Typically requires a Bachelor’s in Science, Technology, Engineering, or Mathematics (STEM) and 10 years of prior relevant experience, or an Advanced Degree in a related field and 7 years of prior relevant experience.  In absence of a degree, 14 years of relevant experience is required. 

• Experience with integrated photonic circuit/chip design, preferably on Silicon platforms. 

• The ability to obtain and maintain a U.S. government issued security clearance is required. U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance. 

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Qualifications We Prefer: 

• Experience with discrete and integrated components, RF photonics devices and system, including RF analysis (i.e., RF-over-fiber linearity, noise, and dynamic range analysis). 

• Experience with integrated photonics (Silicon, Silicon Nitride, and/or compound-semiconductor technologies)  

• Experience with integrated photonics modeling and electronic design tools (e.g., Ansys HFSS/Lumerical, Cadence/Synopsis tools, etc.). 

• Experience leading mixed-signal and hybrid (electronic-photonic) trade studies and engineering efforts involving engineers across multiple disciplines. 

• Demonstrated excellence in interacting with customers and decision makers. 

• Experience silicon and compound semiconductor fabrication technologies. 

• Experience with microelectronic and photonic integrated circuit packaging technologies. 

• Experience with high-performance mixed-signal systems (ADCs, DACs, FPGAs, etc.), to include requirements definition. 

• Experience with state-of-the-art discrete and integrated photonic technologies (modulators, filters, detectors) for RF-over-fiber and digital applications.