Sr. Mechanical Design Engineer, Powertrain Packaging

Rise above. Are you ready to take human possibility to a new dimension with us?

Supernal is an Advanced Air Mobility (AAM) company that’s developing an electric vertical take-off and landing (eVTOL) vehicle and the ground-to-air ecosystem to support the emerging industry. By creating a sustainable, integrated, and human-centered ecosystem, we are committed to taking a thoughtful and responsible approach to entering the AAM market with a product that meets the high level of safety and reliability in today’s air transportation system.

The future of mobility starts with people. We believe in creative thinking and collaboration to help build a better mobility experience for everyone, improving people’s ability to move – whether for work or play. Join our dynamic team as we strive to be a part of something greater where potential powers tomorrow!

Supernal provides an inviting open-space workplace designed to foster collaboration, which aligns with one of our core values. This position is required to work on-site 5 days a week.

What we do:  

The Powertrain System is responsible for designing, prototyping and integrating the high-voltage components and cables, and high-voltage systems in electrified aircrafts. The Sr. Mechanical Design Engineer is critical to the powertrain system development, including conceptual designs, packaging of electrical components and HV cables, prototype electrical components, and launch designs for volume manufacture.  

What you can do: 

• Drive mechanical design of electrical components, interconnects, and electromechanical subsystem designs from conceptual and requirements development through production
• Package high-voltage electrical cables in an aircraft environment
• Select, prove, and implement the application of existing technologies to internal product development and develop new technologies to improve product metrics; for electromechanical components & high voltage cables, this may include interconnects (connectors, cables, terminal lugs, spring fingers, etc.) and packaging interfaces (harness insulation, shielding, strain relief, and cable routing, etc.)
• Provide technical expertise and mentorship to the team in electronics packaging and mechanical design of electronic components, such as wire harnesses, flexible printed circuit boards, connectors, bus bars, and advanced technologies
• Define specifications pertaining to electronic components (dimensional and dielectric, functional, performance, reliability, survivability, component manufacturing, and interface manufacturing
• Perform fundamental prototyping, testing, and analysis tasks and aid with advanced analysis and validation testing
• Identify the root cause of issues in prototype, validation, and production stages and find solutions
• Communicate work progress to department leadership through written and live updates, representing both individual and team efforts
• Collaborate with teams at Supernal sites and meet with suppliers for technology development, process validation, and issue resolution
• Build relationships with critical multi-functional teams in electrical design, testing, safety, abuse, manufacturing, systems, certification, and airframes
• Work with our supplier(s) on releasing components, resolving issues, and ensuring production
• Partner with PMO organization to implement build plan
• Up to 10% of domestic and international travel
• Other duties as assigned 

What you can contribute: 

• Bachelor’s degree in mechanical engineering or relevant engineering field required; Degrees in both mechanical and electrical engineering preferred
• Minimum of five (5) years of experience in mechanical packaging, electrical component, harnesses, and subsystem mechanical design (an equivalent combination of education and experience may be considered)
• Experience designing electronic components: wire harnesses, cable, BUS Bar, connectors, flex printed circuit boards, shielding, twisting, etc.
• Experience designing for volume assembly, including manual and automated processes
• Ability to package electronics to achieve mass, thermal performance, sealing requirements, electrical grounding behavior, mechanical durability
• Knowledge of mechanical design fundamentals, electronic component materials, metallurgy, plating, interconnects, composites, harnesses, connectors, construction, thermal interface materials, dielectric materials, sealing methods
• Ability to translate product requirements into system and subsystem requirements
• Ability to translate subsystem requirements to part