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Senior Packaging Thermal Architect

Intel
United Statesfull_timeVerifiedPosted 5 Dec 2025
💰 $262,680/yr($136,990/yr$262,680/yr)

About the role

Job Details:

Job Description: 

Role Overview:

The Senior Thermal Architect will lead thermal design and strategy for next-generation GPU, AI accelerators, and data center products. This role is critical to enabling high-performance computing at scale while meeting stringent thermal requirements. You will define thermal architecture across silicon, package, and platform levels, ensuring optimal thermal performance for products approaching multi-kilowatt levels:

Key Responsibilities:

Thermal Architecture Leadership

  • Define and deliver advanced packaging thermal solutions for advanced GPU/AI products
  • Architect thermal strategies for 3DIC and advanced packaging technologies, including chiplets and heterogeneous integration.

Design and Analysis

  • Develop analytical and experimental methods for thermal characterization and prediction.
  • Drive co-optimization of thermal, electrical, and mechanical design across silicon, package, and system levels.

Innovation and Technology Development

  • Push the boundaries of thermal management to support Moore's Law progression.
  • Evaluate and integrate emerging cooling technologies (e.g., liquid cooling, immersion cooling) for data center sustainability.

Cross-Functional Collaboration

  • Partner with silicon design, packaging, and platform teams to ensure thermal compliance and performance.
  • Engage with external customers and ecosystem partners to align thermal solutions with product requirements.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Knowledge and/or experience listed below would be obtained through a combination of your school, work and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications

  • MS or PhD in Mechanical Engineering, Thermal Sciences, or related field.
  • 10+ years in thermal design of semiconductor products
  • Proven track record in thermal architecture and advanced packaging.
  • Proficient in thermal simulation tools (e.g., CFD, FEA) and experimental validation.

Preferred Qualifications

  • 10 + years experience in high-performance computing or data center products.
  • Proven track record in GPU/AI thermal architecture and advanced packaging.
  • Experience with rack-scale cooling solutions and liquid cooling technologies.
  • Familiarity with AI/GPU performance trends and their thermal implications.
  • Strong understanding of power delivery, energy efficiency, and cooling technologies.
  • Ability to influence architecture decisions and drive innovation across global teams.

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Arizona, Phoenix

Additional Locations:

US, Oregon, Hillsboro

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits:

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation.  Find more info

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Company

Intel

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