Senior Principal Data Center Engineer - Mechanical Infrastructure

As a Senior Principal Data Center Engineer, you will focus on OCI data center mechanical infrastructure. A mix of technical breadth and depth is required to work cross-functionally with different disciplines (Mechanical, Electrical, Thermal, and Software) to develop thermal solution optimized for the entire data center stack. You will work with internal and external partners, focusing on delivering the next generation of world class hardware and data centers.

• Familiarization with Data Center Cooling Design and ASHRAE Data Center Standards.
• Build, conduct thermal simulations, and review thermal simulation models from partners to identify data center risks and improve efficiency.
• Design and conduct experiments for validating and producing accurate CFD and MBD models by comparing test results against platform telemetry and facility BMS data.
• Engage with leading CFD software companies to drive their product roadmap to meet OCI's requirements for high density fluid cooling solutions.
• Experience in thermal design and analysis of compute architecture and working knowledge of mechanical and electrical system design considerations.
• Understanding mechanical design process to work on all engineering development efforts
• Problem-solving, debug, and failure analysis skills with a solid understanding of core engineering principles and analytical techniques.
• Exposure/hands-on experience with compute-related thermal, airflow, and liquid cooling characterization and validation testing.
• Experience with machine learning, artificial intelligence, and creatibg digital twins.
• Publications in peer-reviewed journals and conferences.
• Experience with data visualization using Tableau, PowerBI, Oracle Analytics Cloud, OR equivalent.
• Experience creating high-level systems concepts, documenting, and evaluating concepts, and providing analysis to other organizations and executives.
• Experience in negotiating, establishing, and managing relationships with vendors
• Communication skills, including the ability to clearly express technical concepts in verbal and written forms.

Career Level - IC5

Requirements And Responsibilities

 Collaborate with internal and external partners across the globe to develop platform hardware and data center infrastructure solutions enabling OCI services.

• Working knowledge and design ability for data center direct-to-chip fluid cooling technologies, including using liquid-to-liquid, liquid-to-air, single-phase and two-phase cooling distribution units, cold plates, manifolds for hybrid of air and liquid data center cooling.
• Collaborate with OCI engineering teams to develop and implement new CFD technologies and methodologies for improving performance and efficiency of OCI platforms and data center infrastructure.
• Technical lead, serving as a resident data center mechanical systems and thermal management domain expert.
• Apply engineering cooling methodologies to craft solutions for small and large-scale data center designs.
• Use Computational Fluid Dynamics (CFD) and flow network modeling tools to generate data center digital twin models from chip to external heat rejection solutions.
• Design and conduct experiments for generating and validating accurate CFD models by comparing test results with platform telemetry and facility BMS data.
• Collaborate with various hardware, thermal, and data center engineering teams to conduct reliability studies, debugging, and expedited resolution of hardware/data center infrastructure issues.
• Working knowledge of HVAC systems, control development, and building automations 
• Problem-solving, debug, and failure analysis skills with a solid understanding of core engineering principles and analytical techniques.
• Exposure/Hands-on experience with compute-related thermal, airflow, and liquid cooling characterization and evaluation testing.
• Lead thermal design reviews and presentations of concepts to peers, partner teams, and executives.
• Work jointly with multidisciplinary teams consisting of both in-house and external partners in the development of Advanced Cooling Solution (ACS) concept prototypes.
• Engage hardware development organizations to drive concepts to the product roadmap and OCI data center fleet.
• Collaborate with multifunctional engineering groups to deliver hardware and data center sites aligned with thermal