Senior Principal Mixed Signal Design Engineer (Hybrid)

Date Posted:

2026-08-10

Country:

United States of America

Location:

US-CA-GOLETA-B01 ~ 6825 Cortona Dr ~ BLDG B01

Position Role Type:

Hybrid

U.S. Citizen, U.S. Person, or Immigration Status Requirements:

U.S. citizenship is required, as only U.S. citizens are authorized to access information under this program/contract.

Security Clearance Type:

None/Not Required

Security Clearance Status:

Not Required

At RTX, the world's largest aerospace and defense company, 185,000 great minds are united by purpose and inspired to make a difference solving the world’s most complex problems. With our three market leading businesses, world-class operations and investments in research and development, we offer capabilities and opportunity no one else can. Together, we push the boundaries of known science and find new ways to connect and protect our world.

Raytheon brings the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. We deliver solutions that help our nation and allies defend freedom and deter aggression, creating a safer, more secure world. Join us and help shape the future of aerospace and defense.

Raytheon Vision Systems is seeking a talented Senior Principal Mixed Signal Design Engineer to join our design team.  This position will be hybrid based in Goleta, CA or Phoenix, AZ.  

As part of this team, you will collaborate in a fast-paced multidisciplinary team environment to develop cutting-edge image sensor products. You will participate in mixed-signal ASIC/ROIC development activities with cross-functional teams including chip architecture, specification, design, verification, validation, fabrication, packaging, debugging, test development, failure analysis, and documentation. 

What You Will Do

• Design, develop, and characterization of Readout Integrated Circuits (ROICs) for advanced sensing systems.
• Evaluate various aspects of the process flow from design to synthesis, place and route, timing and power use. Candidate also must be able to determine architecture design, logic design, and system simulation and define module interfaces for simulation.
• Design mixed-signal integrated circuits for image sensors, including analog signal chain, digital timing and image processing, and low-power 12 – 14 bit on-chip analog to digital converters.
• Guide and coordinate teams of highly skilled engineers in complex, multidisciplinary technical environments.
• Communicate complex technical concepts and program status through briefings and technical reviews with senior government and customer stakeholders, including flag officer–level leadership. 

Qualifications You Must Have

• Typically requires a degree in Science, Technology, Engineering or Mathematics (STEM) and a minimum of 10 years of prior relevant experience or an advanced degree in a related field and a minimum of 7 years of prior relevant experience.
• Experience leading program development for commercial, defense, and/or space industries to complete designs on schedule and within allocated budget.
• Experience with semiconductor device physics, semiconductor processing, linear IC design, simulation, layout (i.e. hand layout critical analog & mixed-signal circuits), and testing.
• Experience in full-custom CMOS Integrated Circuit (IC) design at the transistor level.

Experience with IC Design Flows and any of the following tools:

• CAD tools such as Cadence and Mentor Graphics (Siemens).
• Analysis & programming tools such as MATLAB.
• Computer programming or scripting language such as Python.
• High-end UNIX based software design tools for circuit simulation, transistor model extraction, noise analysis, linear design, layout and layout automation, and verification.
• Modelling experience with System Verilog/Real Modelling/Verilog AMS and coding synthesizable RTL  

Qualifications We Prefer

• Advanced digital design skills such as experience with Conformal, experience with Digital-on-top mixed-signal design flow including utilization of Innovus for final chip construction, and experience writing behavioral models for digital circuits and analog/mixed signal interfaces and circuits.
• Experience with certain IP and circuit blocks such as LVDS transmitters and receivers, low noise and low power amplifiers, ADC design, PLL/Transmitter design and radiation and cryogenic tolerant design techniques.
• Knowledge of high-end UNIX based software design tools for circuit simulation, transistor model extraction, noise