Job Details:

Job Description: 

Intel's Technology Development Component Research (TD CR) delivers innovative semiconductor and packaging technologies research and development. The group focuses on unique, enabling capabilities across all aspects of Intel's semiconductor processing and packaging roadmap. Components Research engineers are responsible for leading programs to design, fabricate and analyze novel devices/interconnects/patterning, materials, and integration schemes across a wide variety of novel applications.

The semiconductor research engineer will work together with a team of researchers on the implementation of exploratory devices and integrated circuits for logic, memory, and novel computing paradigms e.g Compute-In-Memory for AI.

Responsibilities include but are not limited to.

• 1. Emerging Memory Circuit design
• 2. CMOS analog circuit design
• 3. CMOS/non-CMOS based digital circuit/subsystem/full chip design via logic, design/RTL/simulation/placement-and-routing/timing/power (all aspects of SoC design flow).
• 4. work with functional verification.
• 5. work with physical design team to meet timing, area, and power targets.
• 6. work on lab tests of circuits etc.

The main direction of the project will be exploratory circuits for emerging memory. The project will utilize and enhance the skills and capabilities in scientific analysis, problem solving, synthesis of simulation and experimental data, effective communication, and collaboration within the team.

Qualifications:

For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information.

You must possess the below requirements to be initially considered for this position.

Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum qualifications:

•  PhD degree with 2+ years experience in Electrical Engineering, PhD research related to solid state materials, devices, and circuits. PhD research in CMOS analog circuit design
• Experience in Memory Circuit design (SRAM/RRAM/MRAM/FE-RAM)
• Experience in software-hardware co-design using CMOS or emerging technologies for advanced algorithms implementation.
• Experience in CMOS based digital IP or ASIC/SoC design / validation / design-for-test etc with RTL and relevant tools.
• Experience of prototype via simulation in Verilog / RTL /or FPGA etc
• Experience of working on novel computing paradigms.
•  Hands-on experience in creation and utilization of lab setups for electrical characterization. (if testing centric).

 

Preferred qualifications:

• Strong understanding of semiconductor physics
• Expertise in CMOS analog circuit design
• Knowledge of leading nonvolatile memory technologies
• Experience with SRAM design and advanced VLSI systems
• Experience with tape-out of high-performance ICs.
• Experience with logic synthesis, place, and route tools
• Experience with scripting languages like python

The ideal candidate should exhibit the following behavioral traits:

• Highly motivated individual willing to work under pressure and deliver high quality results on time.
• Problem-solving and analytical skills
• Effective prioritization and time management skills
• Stakeholder management, strong collaboration, tolerance for ambiguity, and critical thinking
• Excellent teamwork ethics
• Willing to work in an agile work environment with a fast-paced task flow.
• Good interpersonal skills

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Oregon, Hillsboro

Additional Locations:

Business group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smar