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SR/Principal Thin Films Process Engineer

Micron Technology
United Statesfull_timeVerifiedPosted 26 Aug 2024

About the role

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As part of Micron’s Technology Development (R&D) Organization, you will be working on industry-leading, state of the art next generation memory technology development.

 

As a Senior/Principal Engineer in our Technology Development Group, you will join an existing team of engineers responsible for developing, characterizing, and transferring process solutions for advance DRAM applications. You will ensure the development and implementation of next generation thin film strategy for DRAM, including process, material, and equipment technology. You will be responsible for engaging with internal teams including process development, process integration, equipment development, pilot manufacturing as well as external equipment and chemical suppliers to drive process and tool solutions and collaborate with team of outstanding technologist in generating patents and intellectual property (IP).

 

Responsibilities include, but not limited to:

  • Translate product requirements into efficient processes and innovative solutions
  • Develop, optimize and characterize thin film processes to meet the requirements of ground breaking DRAM technology
  • Take on process related defects, yield and reliability issues
  • Identify and strategize key thin film challenges for next generation DRAM technology node
  • Evaluate vendor tools and chemistries through collaboration and onsite evaluations
  • Work directly with thin film equipment suppliers to develop new equipment and processes to meet Micron’s technological needs for DRAM devices
  • Define and drive roadmap activities next generation DRAM products
  • Design experiments and implement the wafer processing, analyze and present data conclusions and recommendations to various collaborators
  • Work directly with material and equipment suppliers to ensure alignment with Micron’s internal EHSS requirements to build a safe working environment
  • Transfer processes to HVM facilities, and ensure accurate documentation of requirements for equipment and facilities, metrology, quality control, and procedures
  • Develop and monitor quality control plans including statistical process control (SPC) techniques
  • Provide consultation to manufacturing on first of a kind equipment and processes after transfer to ensure successful yield ramp
  • Lead multi-functional process development and defect focus teams

 

Qualifications & Skills:

  • In depth knowledge of chemical reaction engineering, thermodynamics, heat and mass transfer, plasma science and their direct application to thin film processes in various deposition methods
  • Expertise in thin film processes (Dielectric CVD/ALD, EPI Si/SiGe) and tool variables affecting the physical, chemical, and electrical properties of deposited films    
  • Experience with surface analysis techniques like XPS, AFM, XRD, AES, EBSD, SIMS etc.
  • Excellent communication and teamwork skills and a strong attention to detail
  • Excellent data collection and analysis skills
  • Skilled at DOE creation and evaluation
  • Ability to facilitate groups and meeting requirements
  • Effective project leadership skills achieving goals and timelines
  • Ability to thrive in a constantly evolving environment - adapt to and adopt change

 

Education and Experience:

PhD (or equivalent education) in Materials Science, Chemical Engi

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Company

Micron Technology

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