Monolithic Microwave Integrated Circuit (MMIC) Manufacturing Engineer (Associate or Mid-Level)

Monolithic Microwave Integrated Circuit (MMIC) Manufacturing Engineer (Associate or Mid-Level)

Company:

The Boeing Company

Production Engineering organization within Boeing Space Electronics is seeking a Monolithic Microwave Integrated Circuit (MMIC) Manufacturing Engineer (Associate or Mid-Level) who will support board‑level assembly and test processes for MMIC-based modules, from equipment setup and programming to troubleshooting and continuous improvement of production equipment used in module build-up. This includes ensuring smooth production workflows, minimizing downtime, optimizing machine performance, and achieving high‑quality, high‑reliability production standards.

This position will be based out of El Segundo, CA.

Position Responsibilities:

• Establish procedures, standards, protocols, and reporting requirements for board assembly and test operations.

• Utilize lean manufacturing tools; recommend improvements in production methods, standards, tooling, equipment, layout, procedures, product designs, and performance efficiency.

• Support engineering and manufacturing activities for all assembly operations including programming, calibrating, and operating equipment and machines used to build MMIC modules.

• Develop preventive maintenance plans, troubleshoot, and support repairs on production equipment.

• Design and modify tooling, stencils, and shop aids for assembly processes (dispense fixtures, bond frames, custom pallets).

• Develop rework/repair thermal and bonding profiles for rework and repair of electronic assemblies.

• Configure and optimize production equipment and process recipes for building electronics assemblies and support requirements for new designs.

• Maintain build schedule targets by resolving production issues while maintaining the integrity of manufacturing and design requirements.

• Facilitate a close relationship with design, test, and quality teams during design, build, and test to provide continuous feedback required for design improvement and producibility.

• Develop and execute Statistical Process Control (SPC) for manufacturing processes and maintain manufacturing metrics (yield, DPPM, cycle time).

• Work with the design team in response to manufacturing problems, parts obsolescence, and requirement changes.

• Support the transition of products from development to volume production and identify continuous improvement opportunities for yield, performance, and cost.

• Support incoming inspection, nonconformance disposition, and supplier interactions for components and materials used in assembly.

• Additional responsibilities to include supporting the following:

  • DAP (dispense and pick) systems

  • Pick-and-place machines

  • Dispensing systems (solder paste / adhesive / conductive)

  • Plasma cleaning / activation systems

  • Automatic ball-bond and automatic wedge-bond machines

  • Beam‑lead diode bonder and manual wedge bonders

  • Centrifuge for potting/adhesive processing

  • Pull‑test equipment and force gauges

  • Optical inspection and functional test fixtures

Basic Qualifications (Required Skills/Experience):

• Bachelor of Science degree from an accredited course of study in Engineering, Engineering Technology (including Manufacturing Engineering Technology), Materials Science, Physics, Mathematics, Data Science, or Computer Science

• At least 1 year of experience with circuit card and/or electronics manufacturing

• Experience reading and interpreting engineering documents and drawings

• Experience with data analysis tools

• Experience with root cause corrective analysis

Preferred Qualifications (Desired Skills/Experience):

• 3+ years of related work experience or an equivalent combination of education and experience

• 1+ years of related manufacturing or process engineering experience in electronics assembly or module production (or equivalent combination of education and experience).

• Hands‑on experience with multiple i