[Fall 2025/Spring 2026] TSMC Career Opportunities (Arizona/ California/ Texas / Washington / Canada)

Taiwan Semiconductor Manufacturing Company (TSMC) will be visiting your school in the Fall (date and location will be shared later). 

As the leading semiconductor foundry in the world, we have been at the forefront of technological innovation for over 30 years. In 2024, TSMC served 522 customers and manufactured 11,878 products for various applications covering a variety of end markets including high performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. We strive to provide a diverse and inclusive environment to inspire passion and enable the best in our employees. As the company expands globally, we are actively seeking talent in Research and Development, Operations, and other supporting functions in world-wide locations.

Join TSMC for a fulfilling career with endless growth possibilities. We hope to see you in the fall!

Job Opportunities:

Operations/Fab related Roles (Please note that Operations/Fab related roles will primarily be located in Phoenix, Arizona or Camas, Washington.)

1. Process Integration Engineer (PID)
   Focus on analyzing Inline and EOL (End-of-Line) electrical data to determine causes for issues, in collaboration with Integration, YED (Yield Excellence Department), and Process/Equipment engineers.
    
2. Yield Excellence Engineer (YED)
   Focus on defect inspection methodology to effectively deduce the root cause of critical issues by collaborating with respective stakeholders and innovate the current techniques to combat defect issues live on the production line.
    
3. Process Engineer (PE)
   Focus on delivering robust and efficient semiconductor manufacturing through data-driven analytics and systematic problem-solving. Optimize processes with experimental design, precision control, and statistical methods. Collaborate with suppliers to address technology gaps and focus on continuous improvement in stability, quality, yield, productivity, and safety.
   
     ● CMP   : Chemical Mechanical Planarization
     ● CVD   : Chemical Vapor Deposition
     ● PVD   : Physical Vapor Deposition
     ● EPI     : Epitaxy
     ● DIF     : Diffusion
     ● WET   : Wet Clean
     ● ME     : Metrology
     ● Etch   : Wet Etch and Dry Etch
     ● LIT     : Lithography
    
4. Equipment Engineer (EE)
   Focus on improving and maintaining tool performance in a cleanroom environment to ensure quality production. Key duties include troubleshooting alarms, installing and qualifying new tools, resolving critical equipment issues, and improving tool uptime. Additionally, the role involves enhancing hardware capabilities, implementing systems to prevent equipment failures, and managing vendor relationships while coordinating with facilities, vendors, and manufacturing teams.
   
     ● CMP   : Chemical Mechanical Planarization
     ● CVD   : Chemical Vapor Deposition
     ● PVD   : Physical Vapor Deposition
     ● EPI     : Epitaxy
     ● DIF     : Diffusion
     ● WET   : Wet Clean
     ● ME     : Metrology
     ● Etch   : Wet Etch and Dry Etch
     ● LIT     : Lithography
    
5. Intelligent Manufacturing Engineer (MFG)
   Focus on ensuring the timely delivery of high-quality wafers by driving productivity and efficiency through advanced technologies such as Smart Scheduling and Precise Dispatching. Responsibilities include system optimization, productivity improvement initiatives, and quality defense enhancements to support daily operations.
    
6. Advanced Material Handling System (AMHS) Engineer
   Focus on automated systems that ensure efficient, timely, and accurate wafer transfers. Projects may include improving Delivery Time Accuracy (DTA) or enhancing Stocker dispatching systems to optimize lot movement and cycle times.
    
7. Quality Management Engineer (AQE)
   Support on TSMC's mission of world-class quality systems by collaborating with Taiwan's Central Quality team. This role includes monitoring wafer fabrication processes, analyzing manufacturing parameters, applying statistical