Senior Staff Engineer, Packaging

pSemi Corporation is a Murata company driving semiconductor integration. pSemi builds on Peregrine Semiconductor’s 30-year legacy of technology advancements and strong IP portfolio but with a new mission—to enhance Murata’s world-class capabilities with high-performance semiconductors. With a strong foundation in RF integration, pSemi’s product portfolio now spans power management, connected sensors, optical transceivers, antenna tuning and RF frontends. These intelligent and efficient semiconductors enable advanced modules for smartphones, base stations, personal computers, electric vehicles, data centers, IoT devices and healthcare. From headquarters in San Diego and offices around the world, pSemi’s team explores new ways to make electronics for the connected world smaller, thinner, faster and better.

Job Summary

Reporting to the Director of Platform engineering of the power semiconductor business unit, this individual will be responsible for all aspects of power semiconductor packaging, working closely with our engineering team to support product during the entire product life cycle from product definition through product release to volume production and post-production package related works through OSAT. Fully conversant with advanced power semiconductor packaging technology, the successful candidate will be a part of a cross-functional product development team critical for bringing state-of-art power management products to market.

Roles & Responsibilities

This position has responsibility for:

• Implementing and maintenance of power semiconductor packaging technology process flows suitable for use in high volume, high reliability, industrial, datacoms, telecoms and commercial applications like laptop or handset devices.
• Detailed product packaging design including use of simulation tools to assess design integrity and performance such as modeling of parasitic losses, thermal dissipation, mechanical stress etc.
• Guide design team what they should do or not based on the experiences with power, well familiar with OSATs and their roadmaps.
• Developing a forward-looking packaging roadmap that is aligned with our product roadmap, work with design engineering understanding their needs. Validating and qualifying new packaging technologies ahead of new product development.
• Working seamlessly with our power semiconductor chip architects from concept stage through to final product realization to assure highly optimized designs that maximize product performance with highest possible field reliability.
• Close collaboration with cross functional team members to assure on-time delivery of new products through all aspects of design and qualification including production, test engineering, characterization, quality, reliability, and sustaining engineering.
• Close collaboration with key supply chain partners, including wafer fabs, OSATs, outsourced test and characterization organizations, and logistics.
• Sign-off on PCB designs for all critical boards (REL/EVB/etc), documentation inputs for customer datasheets and application notes relating to soldering profile, thermal considerations, reliability etc.

Competency Requirements

In order to perform the job successfully, an individual should demonstrate the following competencies:

• Driving for Results: Aggressively pursues challenging goals and objectives; will put in considerable time and effort to accomplish objectives; takes a highly focused, goal driven approach toward work
• Acting Decisively: Moves quickly to make decisions and commit to a clear course of action; comfortable making decisions based on partial information; willing to take risks in order to maintain momentum; shows a strong bias toward action
• Acting as a Champion for Change: Challenges the status quo; encourages people to question existing methods, practices, and assumptions; supports people in their efforts to try new things
• Critical thinking:  Skilled at finding logical flaws in arguments and plans; identifies problems and solutions that others might miss; provides detailed insight and constructive criticism into problems and complex situations
• Working with Ambiguity: Achieves forward progress in the face of poorly defined situations and/or unclear goals; able to work effectively with limited or partial information

Minimum Qualifications (Experience and Skills)

• Typically requires 8 to 12 years of experience in power-semiconductor packaging.
• 2+ years project or technical leadership.
• Thorough understanding and demonstrated experience in the use of advanced packaging technologies, including WLCSP, FCOL, CuP, MCM, embedded die in substrate, passive component in package, single-side/double-side component in package, back-side die attach etc.
• Thorough understan