Senior Process Engineer - Lithography #5427Senior Process Engineer - Lithography #5427

Job Title
Senior Process Engineer – Lithography #5427

Statement about position/company:
A job at TSMC Arizona offers an opportunity to work at the most advanced semiconductor fab in the United States. TSMC Arizona’s first fab will operate its leading-edge semiconductor process technology (N4 process), starting production in the first half of 2025. The second fab will utilize its leading edge N3 and N2 process technology and be operational in 2028. The recently announced third fab will manufacture chips using 2nm or even more advanced process technology, with production starting by the end of the decade. America’s leading technology companies are ready to rely on TSMC Arizona for the next generations of chips that will power the digital future.

As a Senior Process Engineer – Lithography, you will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values – Integrity, Commitment, Innovation, and Customer Trust. Multiple positions available.

Senior Process Engineer – Lithography - Brief Description
Conduct wafer fabrication photolithography including new process development, integration, and process improvement. Lead the design and execution of experiments, interpreting and extracting insightful results from complex data sets to optimize the manufacturing process and achieve precision control at atomic levels.

Responsibilities:

• Apply statistical process control methods to establish and sustain a robust manufacturing process.
• Supervise the installation and maintenance of manufacturing equipment to expand capacity with punctuation and quality.
• Serve as a lead point of contact with equipment and material suppliers and partners to identify technology gaps and deficiencies; devise, evaluate and qualify mitigation and continuous improvement solutions.

Minimum Qualifications/Requirements:

Education and Work Experience:

• Must have a Master’s degree or foreign equivalent in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, Materials Science or a related field, and 1 year of engineering experience.
• Alternatively, will accept a Bachelor’s degree or foreign equivalent in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, Materials Science or a related field and 3 years of engineering experience.

 

Technical Skills:

 

• Must have 1 year of experience in at least 2 of the following: Design of Experiment (DOE); semiconductor fabrication; statistical process control; or statistical methods for modeling multivariate data sets.
• Must have 1 year of experience in at least 1 of the following metrology used in semiconductor processing: Transmission Electron Microscopy (TEM); Scanning Electron Microscopy (SEM); Critical Dimension SEM (CD-SEM); Energy Dispersive X-ray Spectroscopy (EDS); Focused Ion Beam (FIB); Atomic Force Microscopy (AFM); X-ray Diffraction (XRD); Emission Spectroscopy; Raman Spectroscopy; Spectroscopic Ellipsometry; Quartz PCI; or Fourier Transform Infrared Spectroscopy (FT-IR).
• Must have 1 year of experience in at least 5 of the following semiconductor photolithography tools or processes: N4 and N5 IC manufacturing process; DUV Photolithography 193nm and 248nm (ASML Twinscan Scanners); 193nm immersion multiple patterning processes including litho-etch-litho-etch (LELE) and self-aligned double patterning (SADP); JMP (statistical analysis software); ASML Yield Star; Overlay modeling, alignment, optics and focus control for semiconductor lithography; Defect Source Investigation; 6-Sigma FAB EHS (Environment, Health and Safety); or Photoresists.
• Must have 1 year of experience in at least 2 of the following advance control in scanner: CD (critical dimension) APC; DOMA (Dose mapper); GridMa (Grid mapper); ProVision; Agile (AirGauge Improved LEveling); cASCAL (computational Application Specific (lens heating) CALibration); TopRC (TOP Reticle Control); FlexRay: unlimited flexibility and control to shrink; or Flexwave.

 

Physical Requirements:

• Candidates must be willing and able to work on-site at our Phoenix Arizona facility.

Standard Work Hours: 40 hrs/week, Mon-Fri, 8:30 a.m. - 5:30 p.m.