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Thermal & Mechanical Engineer, Annapurna Labs
Amazon.comUnited Statesfull_timeVerifiedPosted 15 Aug 2025
💰 $212,800/yr($129,800/yr – $212,800/yr)
About the role
Amazon Web Services provides a highly reliable, scalable, low-cost infrastructure platform in the cloud that powers hundreds of thousands of businesses in 190 countries around the world. We have data center locations in the U.S., Europe, Singapore, and Japan, and customers across all industries. We are seeking experienced Hardware Design Engineers to build the next generation of our cloud server infrastructure. Our success depends on our world-class server infrastructure; we’re handling massive scale and rapid integration of emergent technologies.
As a member of the Machine Learning Acceleration team you’ll be responsible for the design and optimization of hardware in our data centers. You’ll provide leadership in the application of new technologies to large scale server deployments in a continuous effort to deliver a world-class customer experience. This is a fast-paced, intellectually challenging position, and you’ll work with thought leaders in multiple technology areas. You’ll have high standards for yourself and everyone you work with, and you’ll be constantly looking for ways to improve your products performance, quality and cost. We’re changing an industry, and we want individuals who are ready for this challenge and want to reach beyond what is possible today.
Key job responsibilities
As a Thermal/Mechanical Engineer, you design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You develop from the lowest levels of circuit design to large system design and see those systems all the way through to high volume manufacturing. Your work has the potential to shape the machinery that goes into our cutting-edge data centers affecting millions of AWS users.
About the team
In 2015, Annapurna Labs was acquired by Amazon Web Services (AWS). Since then, we have accelerated its innovation and developed a number of products that benefit cloud customers, including AWS Nitro technology, Inferentia custom Machine Learning chips, and AWS Graviton2 processors.
Annapurna Labs is a silicon/system and software organization that is delivering all the chips used by AWS customers. Today this includes: Graviton, driving innovation for general purpose compute; Nitro, driving networking and storage scale, security and Hypervisor offload, and Machine Learning (ML) Trainium and Inferentia that are enabling customers to train and run GenAI applications permanently while keeping costs under control.
Key job responsibilities
As a Thermal/Mechanical Engineer, you design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You develop from the lowest levels of circuit design to large system design and see those systems all the way through to high volume manufacturing. Your work has the potential to shape the machinery that goes into our cutting-edge data centers affecting millions of AWS users.
About the team
In 2015, Annapurna Labs was acquired by Amazon Web Services (AWS). Since then, we have accelerated its innovation and developed a number of products that benefit cloud customers, including AWS Nitro technology, Inferentia custom Machine Learning chips, and AWS Graviton2 processors.
Annapurna Labs is a silicon/system and software organization that is delivering all the chips used by AWS customers. Today this includes: Graviton, driving innovation for general purpose compute; Nitro, driving networking and storage scale, security and Hypervisor offload, and Machine Learning (ML) Trainium and Inferentia that are enabling customers to train and run GenAI applications permanently while keeping costs under control.
BS or MS degree in Mechanical/Thermal Engineering
5+ years industry experience in Mechanical and Thermal design of Systems
Experience in thermal and performance measurements and characterization on SoCs, Servers, and Systems
3+ years of experience SoC Thermal modelling and IC package transient thermal response
Experience with Chip package, System Mechanical & Thermal design for air-cooled and liquid-cooled systems
Collaborate effectively with teams spanning multiple sites and develop detailed specifications for product teams to use
Work with ODMs, heatsink vendors, and internal design teams on cross-boundary triaging, debugging, and resolving issues across organization.
Tool Familiarity: Ansys Icepak, FloTherm, Cadence Celsius, PTC Creo, and Solidworks
Programming experience: Bash script, Shell script, Linux, Python, and Lua. Familiarity with working in Linux environment is an added advantage
Working knowledge on fans, valves, chillers, and CDUs
Knowledge of various types of technologies used for Heatsink solutions, Th
As a member of the Machine Learning Acceleration team you’ll be responsible for the design and optimization of hardware in our data centers. You’ll provide leadership in the application of new technologies to large scale server deployments in a continuous effort to deliver a world-class customer experience. This is a fast-paced, intellectually challenging position, and you’ll work with thought leaders in multiple technology areas. You’ll have high standards for yourself and everyone you work with, and you’ll be constantly looking for ways to improve your products performance, quality and cost. We’re changing an industry, and we want individuals who are ready for this challenge and want to reach beyond what is possible today.
Key job responsibilities
As a Thermal/Mechanical Engineer, you design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You develop from the lowest levels of circuit design to large system design and see those systems all the way through to high volume manufacturing. Your work has the potential to shape the machinery that goes into our cutting-edge data centers affecting millions of AWS users.
About the team
In 2015, Annapurna Labs was acquired by Amazon Web Services (AWS). Since then, we have accelerated its innovation and developed a number of products that benefit cloud customers, including AWS Nitro technology, Inferentia custom Machine Learning chips, and AWS Graviton2 processors.
Annapurna Labs is a silicon/system and software organization that is delivering all the chips used by AWS customers. Today this includes: Graviton, driving innovation for general purpose compute; Nitro, driving networking and storage scale, security and Hypervisor offload, and Machine Learning (ML) Trainium and Inferentia that are enabling customers to train and run GenAI applications permanently while keeping costs under control.
Key job responsibilities
As a Thermal/Mechanical Engineer, you design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You develop from the lowest levels of circuit design to large system design and see those systems all the way through to high volume manufacturing. Your work has the potential to shape the machinery that goes into our cutting-edge data centers affecting millions of AWS users.
About the team
In 2015, Annapurna Labs was acquired by Amazon Web Services (AWS). Since then, we have accelerated its innovation and developed a number of products that benefit cloud customers, including AWS Nitro technology, Inferentia custom Machine Learning chips, and AWS Graviton2 processors.
Annapurna Labs is a silicon/system and software organization that is delivering all the chips used by AWS customers. Today this includes: Graviton, driving innovation for general purpose compute; Nitro, driving networking and storage scale, security and Hypervisor offload, and Machine Learning (ML) Trainium and Inferentia that are enabling customers to train and run GenAI applications permanently while keeping costs under control.
Basic Qualifications
BS or MS degree in Mechanical/Thermal Engineering
5+ years industry experience in Mechanical and Thermal design of Systems
Experience in thermal and performance measurements and characterization on SoCs, Servers, and Systems
3+ years of experience SoC Thermal modelling and IC package transient thermal response
Experience with Chip package, System Mechanical & Thermal design for air-cooled and liquid-cooled systems
Collaborate effectively with teams spanning multiple sites and develop detailed specifications for product teams to use
Work with ODMs, heatsink vendors, and internal design teams on cross-boundary triaging, debugging, and resolving issues across organization.
Preferred Qualifications
Knowledge of SoC thermal/mechanical design methodology, power modeling and thermal analysis techniquesTool Familiarity: Ansys Icepak, FloTherm, Cadence Celsius, PTC Creo, and Solidworks
Programming experience: Bash script, Shell script, Linux, Python, and Lua. Familiarity with working in Linux environment is an added advantage
Working knowledge on fans, valves, chillers, and CDUs
Knowledge of various types of technologies used for Heatsink solutions, Th
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