Equipment Engineer, Photo and Ebeam Lithography Development, Microelectronics Research Center

Job Posting Title:

Equipment Engineer, Photo and Ebeam Lithography Development, Microelectronics Research Center

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Hiring Department:

Office of the Vice President for Research, Scholarship and Creative Endeavors

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Position Open To:

All Applicants

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Weekly Scheduled Hours:

40

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FLSA Status:

Exempt

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Earliest Start Date:

Immediately

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Position Duration:

Expected to Continue

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Location:

AUSTIN, TX

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Job Details:

General Notes

The Microelectronics Research Center (MRC) laboratories serve users from both universities and corporations across many different fields: electronics, optics, physics, chemistry and astronomy, as well as chemical, mechanical and petroleum engineering. The MRC is more than a clean room with a comprehensive set of advanced nano-fabrication equipment; it is a community of scientists who work together to build advanced technology products and knowledge.
 

UT Austin offers a competitive benefits package that includes:  

• 100% employer-paid basic medical coverage  

• Retirement contributions

• Paid vacation and sick time

• Paid holidays

Please visit our Human Resources (HR) website to learn more about the total benefits offered.

Purpose

The Lithography Engineer leads development, optimization, and sustainment of advanced lithography processes in a shared-user research cleanroom. The role focuses on direct-write lithography techniques, including photolithography and electron-beam lithography, with strong integration of metrology to achieve precise linewidth control, overlay accuracy, and pattern fidelity. This role is also expected to work as part of a team to ensure optimal tool performance for photolithography and electron‑beam lithography systems through calibration, diagnostics, maintenance coordination, and performance monitoring. The engineer supports microfabrication research and prototyping through maintaining tool availability, exposure accuracy, overlay performance, and system stability, while working in close coordination with process engineers, technicians, and users for recipe development, experimental design, data analysis, user training, and equipment diagnostics.

Responsibilities

Tool Performance, Reliability, and Sustainment

• Maintain and optimize the performance of photolithography and electron‑beam lithography equipment to meet facility capability and uptime targets.

• Troubleshoot process deviations and tool-related issues using structured root cause analysis.

• Monitor key tool performance metrics, including exposure stability, overlay accuracy, focus control, beam current stability, and stage performance.

• Perform routine performance verification, tool matching, and calibration to ensure consistent and repeatable operation.

• Perform diagnostic testing and hardware troubleshooting in coordination with maintenance staff and vendors.

• Support tool qualification, calibration, acceptance testing, and preventive maintenance activities.

Diagnostics, Troubleshooting, and Repair

• Diagnose and resolve equipment-related issues impacting lithography performance using systematic troubleshooting and root cause analysis.

• Perform diagnostic testing and hands-on hardware troubleshooting, including replacement of boards, sensors, stages, vacuum components, and mechanical assemblies.

• Support preventive maintenance planning and execution to minimize downtime and performance drift.

Process Development and Optimization

• Assist users to develop, optimize, and document photolithography and electron-beam lithography processes for a wide range of device structures and materials as needed.

• Assist users in designing and executing experiments to push tool and process limits in resolution, contrast, sidewall quality, and pattern fidelity.

• Assist users to address proximity effects, resist behavior, exposure strategies, and process bias through systematic experimentation and modeling.

Metrology and Data Integration

• Utilize lithography-related metrology (e.g., optical inspection, SEM, AFM, overlay and CD measurements) to validate tool performance ensure precise linewidth control and overlay accuracy.

• Correlate metrology results with tool settings and hardware condition to identify performance trends and degradation.

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