Job Details:

Job Description: 

Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain.
As stewards of Moore's Law, we persistently innovate and foster collaboration within an extensive partner ecosystem to advance technologies and enable our customers to design leadership products. Our strategic investments in geographically diverse manufacturing capacities bolster the resilience of the semiconductor supply chain, particularly for advanced products. Leveraging our technological prowess, expansive manufacturing scale, and a more sustainable supply chain, Intel Foundry empowers the world to deliver essential computing, server, mobile, networking, and automotive systems for the AI era.

About the Role
Intel Foundry Services is seeking a highly experienced and collaborative Packaging and Test Account Technical Solutions Engineer to lead customer engagements for key Packaging and Test customers. This role is pivotal in enabling our foundry customers who are using Intel's advanced technology solutions, including our cutting-edge Advanced Packaging capabilities.

Key Responsibilities:

• Own the end-to-end customer relationship as the primary interface between the customer and Intel, ensuring seamless communication, trust, and alignment across all phases of engagement.
• Work directly with customer to understand packaging challenges and requirements and provide technical consultation on packaging solutions and processes.
• Engage expert stakeholders across Intel Foundry to ensure customers have firsthand access to information.
• Collaborate with cross-functional teams including Technology Development, Product Engineering, Manufacturing and Operations, and Customer Engineering teams providing feedback to influence product and technology roadmaps.
• Lead and coordinate all internal Intel interactions related to the customer account to drive commitment to execution across schedule, quality, technical execution, qualification and volume ramp.
• Develop and maintain the Statement of Work (SOW) documenting customer requirements, Intel Foundry commitments, technical deliverables, and schedule milestones.
• Manage full customer engagement lifecycle from initial design award through development, ramp, high volume manufacturing (HVM), and end of life.
  • Track and drive closure of customer commitment, action items and escalations.
  • Monitor milestones, risks, dependencies and change requests.
  • Drive resolution of issues affecting qualification and delivery.
  • Provide clear status reports to both customers and leadership.
  • Serve as the Voice of the Customer inside Intel Foundry, ensuring customer priorities, risks, and expectations are clearly communicated and advocated across all internal functions.

Required Skills and Experience

• Experience in Semiconductor Packaging
• Strong communication, project management and customer-facing skills
• Ability to operate across both technical and operations discussions
• Problem-solving and analytical thinking
• Ability to explain complex technical concepts clearly
• Willingness to travel

Preferred Skills and Experience

• Strong communication, project management and customer-facing skills
• Ability to operate across both technical and operations discussions
• Problem-solving and analytical thinking
• Ability to explain complex technical concepts clearly
• Willingness to travel

Qualifications:

• Bachelors or Masters Degree in Electrical Engineering, Materials Science, Mechanical Engineering or Chemical Engineering or related field.
• 10+ years industry experience
• 5+ years in Semiconductor Packaging, Assembly / Test or Backend Manufacturing, Operations, Product Engineering, Field Applications or customer-facing engineering

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Arizona, Phoenix

Additional Locations:

US, California, Folsom, US, California, Santa Clara, US, Oregon, Hillsboro, US, Texas, Austin

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership