: Chiplets and Heterogeneous Integration Intern

Are you a problem solver looking for a hands-on internship position with a market-leading company that will help develop your career and reward you intellectually and professionally?

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $12 billion in FY22 and approximately 25,000 people globally working alongside 125,000 global customers, ADI ensures today’s innovators stay Ahead of What’s Possible.

At ADI, you will learn from the brightest minds who are here to help you grow and succeed. During your internship, you will make an impact through work on meaningful projects alongside a team of experts. Collaborating with colleagues in an environment of respect and responsibility, you will create connections that will become a part of your professional network.

ADI’s culture values aligned goals, work-life balance, continuous and life-long learning opportunities, and shared rewards. The internship program features various lunch-and-learn topics and social events with other interns and full-time employees.

At ADI, our goal is to develop our interns so they are the first to be considered for full-time roles.

Apply now for the opportunity to grow your career and help innovate ahead of what’s possible.

• We might have several internships with the same discipline, so if you can add your group or something that differentiates it that would be helpful for candidates applying. For example: Instead of Software Intern, maybe put Software Intern (X group or X business unit)

The Internship program at ADI provides young professionals with the opportunity to gain professional experience within an innovative and global company. ADI’s long-term goal is to convert an intern into a full-time employee. The University Relations Team continually strives to accomplish this goal year-after-year by establishing a well-equipped program (virtual and in person) that focuses on growth, company culture, and mentorship, coupled with a collaborative work environment and passion for innovation. On average, each year, ADI converts roughly 70%-80% of their interns into full time hires!

ADI provides a high-quality internship program that the company has consistently been known for. These events revolve around the cross collaboration with peers and include executive speakers, lab tours, development events, social events, and community service opportunities. Our Intern Program provides opportunity for interns to collaborate and learn, drive results, and grow their professional network. Apply now for the opportunity to start your career and help innovate ahead of what’s possible!

The Advanced Technology Group in the Chief Technology Office is looking for an engineering intern as part of a larger team that addresses next generation technology needs for chiplets and heterogeneous packaging. Our team interacts broadly across the company to reduce friction in the adoption of chiplet-based design and advanced packaging. This is accomplished by analyzing existing gaps, coming up with targeted development projects to address these gaps and executing them. Your role be to support these efforts through smaller standalone analyses. As part of our team, you will operate at the intersection of business justification, technology trends and engineering feasibility analysis.

Responsibilities include, but not limited to:

• Investigate trends in chiplet technology and advanced packaging
• EM-simulations of D2D interfaces across different packaging configurations
• Develop a framework to analyze chiplet development cost versus SoC approach
• Explore options for low-bandwidth die-to-die options
• Help with Die-to-Die test chip evaluation

Minimum qualifications

• Major in Electrical Engineer or related discipline, master’s or PhD student preferred
• Basic understanding of chip making and packaging process flow
• Basic understanding of cost modeling and economics
• Programming experience in Python, VBA or similar
• Good with Microsoft Office, especially PowerPoint

Preferred qualifications

• Knowledge of chiplet technology and advanced packaging
• Experience with electromagnetic simulators such as EMPro, Momentum, or HFSS

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export  licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Di