Group Leader - Electronics Packaging Design 1

Overview

Draper is an independent, nonprofit research and development company headquartered in Cambridge, MA. The 2,000+ employees of Draper tackle important national challenges with a promise of delivering successful and usable solutions. From military defense and space exploration to biomedical engineering, lives often depend on the solutions we provide. Our multidisciplinary teams of engineers and scientists work in a collaborative environment that inspires the cross-fertilization of ideas necessary for true innovation. For more information about Draper, visit www.draper.com.

 

Our work is very important to us, but so is our life outside of work. Draper supports many programs to improve work-life balance including workplace flexibility, employee clubs ranging from photography to yoga, health and finance workshops, off site social events and discounts to local museums and cultural activities. If this specific job opportunity and the chance to work at a nationally renowned R&D innovation company appeals to you, apply now www.draper.com/careers.

 

 

Equal Employment Opportunity

Draper is committed to creating a diverse environment and is proud to be an affirmative action and equal opportunity employer.   We understand the value of diversity and its impact on a high-performance culture.  All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, disability, age, sexual orientation, gender identity, national origin, veteran status, or genetic information.   

 

Draper is committed to providing access, equal opportunity and reasonable accommodation for individuals with disabilities in employment, its services, programs, and activities. To request reasonable accommodation, please contact hr@draper.com.

Responsibilities

This Group Leader position is for the “Electronics Packaging Design 1” group in the Mechanical Engineering and System Packaging Division. The group is one of two groups responsible for developing novel, often high-density mechanical packaging solutions for the analog, digital, RF, and optical electronics designed at Draper. The candidate selected for this position will work closely with the GL of the “sister group” (Electronics Packaging Design 2) on staffing, technology development, staff development, and hiring for this important skillset. You will also be an active technical contributor on programs.  Primary responsibilities include:

• Assure the long-term success of the group by shaping the group’s talented workforce, and maintaining and developing key, differentiating capabilities that align with customer needs
• Collaborate regularly with internal group members, Draper program offices, Customers/Sponsors, other Draper engineering groups, and the external technical community
• Partner with Customers/Sponsors, Draper program managers and subject matter experts within Draper to develop and implement strategic plans and roadmaps
• Support and enable the technical and career growth of individual staff members by performing regular check-in reviews and annual performance reviews, as well as advocating for leadership and training opportunities

Additional technical responsibilities may include:

• Guide staff and program execution during design, development, integration, test, and fielding of systems to ensure they meet technical, cost, and schedule requirements
• Act as a Subject Matter Expert (SME) in mechanical design and development associated with the physical arrangement of electronic circuits (including assembly design, analysis, build, test, and documentation support)

Qualifications

Required Qualifications:

• Minimum of Bachelor of Science degree in mechanical engineering, electrical engineering, or similar with 5-7+ years of experience in application of those skills to design and delivery of high-technology products
• Excellent communication skills, both written and verbal
• Experience leading teams of people that span experience and technical disciplines
• Experience developing tactical and strategic visions, budgets, and plans
• Experience with materials, fabrication, and assembly techniques associated with printed circuit assemblies including surface mount technology, high density substrates, rigid-flex designs, and integrated circuit assembly
• Experience designing/directing the physical layout of electrical circuits including SMD, interconnect definition, and integrated circuit assembly techniques
• Experience designing in 3D CAD using SolidWorks and/or CREO

Preferred Qualifications:

• Experience with PLM systems, especially 3DX
• Experience with analysis tools such as ANSYS, COMSOL, and/or MatLab
• Familiarity with bare-