Senior Process Engineer, Test and Packaging

Rigetti Computing is developing full stack quantum computers to solve humanity’s most pressing and valuable problems. We are a highly diverse and interdisciplinary team of engineers and scientists working at the cutting edge of technology in a mission-driven entrepreneurial environment. We believe that bringing together teams from various cultures, educational backgrounds, and technical disciplines helps them to see things from more points of view and to make great products that change the world for the better.
As the Test & Packaging Engineer, you will be working in our state-of-the-art fabrication facility, Fab-1, where we build superconducting quantum integrated circuits developing and sustaining wafer/die electrical probing and die packaging equipment and process. You will spend your time immersed in the hands-on fabrication and measurement of these devices. You will work in a collaborative environment with a wide range of engineers, technicians and scientists in process integration, fab production, design, and quantum engineering teams.

Key Responsibilities

• Wafer/Die/Package Testing:
• Sustain wafer probe equipment to test electrical properties of superconducting quantum circuits.
• Develop and deploy new test programs and functions on the equipment in a production environment.
• Troubleshoot and resolve issues related to probe equipment and test procedures including but not limited to electrostatic damage (ESD).
• Experience working with low level measurement and various types of probe cards and understanding their applications and resolution of related issues


• Packaging:
• Take ownership of assembly and packaging equipment and processes including, but not limited to: die attach, wire bonding, flip chip attach, wafer singulation, wafer bonding and other packaging processes.
• Create packaging diagrams and specify requirements for assembly tooling, fixtures and equipment to support manufacturing operations and damage free die handling.

Additional Responsibilities

• Support test, assembly and packaging development activities working through the evolution details of next generation process/architecture/product/approach, collaborating with other frontend and backend modules.
• Establish process metrologies, key metrics, and parameters. Document and maintain monitors and statistical process controls to run a predictable and capable process.
• Create specifications, document processes and written work instructions for production deployment.
• Guide technicians and operators in process and equipment operation and troubleshooting. 
• Maintain and monitor failure pareto from daily production activities, and recommend product and process improvements to enhance yield and efficiency.
• Organize failure data, draw correlations from process interactions and present results in a concise fashion.
• Prepare process requirement documents in defining and acquiring new equipment. Install and qualify new equipment and establish processes.
• Key member of the team to continue developing Rigetti Fab as a leading quantum integrated circuit foundry.

About You

• Disciplined hands-on approach to development work and technical problem solving.
• MS and/or Ph.D. in Science or Engineering field is highly preferred.
• At least 3-7+ years of hands-on experience in wide range of semiconductor/MEMS e-test, assembly and packaging tools, such as wafer probers, package probers, wire bonders, die attach, epoxy dispense, flip-chip assembly, surface mount technology (SMT), flux/solder (paste and solder balls), underfilling and cure, and relevant metrology tools. Hands-on experience in die-prep tools, such as wafer mount, wafer singulation, and die eject and handling. Familiar with temporary and permanent wafer bonding.
• Strong understanding of semiconductor fabrication processes and electrical measurement instrumentation. Experience with superconducting materials is a plus.
• Good understanding of cross-functional packaging areas is a definite plus. Familiarity in reviewing Silicon floor plan, package layout and architecture, thermal, mechanical, material, component & system level reliability, testing and failure analysis preferred.
• Strong communication skills. Ability to work in a cross-functional team.
• Ability to work independently and manage priorities and stakeholders. Ability to deal with ambiguity in defining activities and direction.
• Strong background in SPC and DOE methodologies, GR&R, root-cause fixes and application of containment solutions.
• Comfortable working in cleanroom fab adhering to HAZMAT and ESD practices.
• High degree of comfort with a flexible and agile company environment. Flexibility in work hours and work days.
• Comfortable with MS O