Packaging Lab Engineer - Part-time Internship

Micross Advanced Interconnect Technology is seeking a knowledgeable, self-motivated physical science or engineering student for an internship with our Packaging Lab team. The internship will be technical support for electroplating process and semiconductor Packaging Lab operations. Analysis of plating solutions via titrations, HPLC, UV VIS, pH monitoring. Maintain analysis log for all chemical components. Up keeping of chemical’s inventory of reagents and plating solutions. Process support for Packaging Lab operations (electro plating, metrology and backend process). Interact with Packaging Lab Manager on data maintenance and chemical adjustments to plating solutions. Support equipment maintenance on analysis tools with the equipment engineering group assistance.

This is a spring internship that can be extended into the summer.

25 hours a week maximum.

Other Duties & Responsibilities:

• Comply with all safety policies, practices and procedures.

• Comply with all quality and ITAR policies, practices and procedures;
• Participate in proactive team efforts to achieve departmental and company goals;
• Contribute to building a positive team spirit;
• Communicate effectively with all levels of employees;
• Protect confidential information by not communicating, disclosing to, or using for benefit of 3rd parties.
• Perform other related duties as assigned

Requirements

• Rising senior in a B.S Chemistry, Chemical or Materials Science Engineering program or B.S. working toward an advanced degree.
• Excellent hands-on laboratory skills
• Excellent written and verbal communication skills
• PC proficiency is a must
• Working knowledge of Word, EXCEL, and PowerPoint
• Cleanroom experience is a plus
• Wafer processing experience is a plus

Due to Micross AIT’s business and ITAR-registration status, successful candidates must be US citizens or US permanent resident.

Benefits

If you are interested in gaining valuable semiconductor processing experience, working in a dynamic, back-end-of-line wafer processing facility focused on advanced packaging and interconnect technologies, please apply.