(Senior) PIC Design Engineer - Architecture & Fiber Coupling (f/m/d)

Your mission

The future of AI computing builds on light. Q.ANT is building photonic processing systems that compute with light - delivering a scalable, energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications. Q.ANT’s photonic integrated circuits are at the heart of this technology.

You will drive the design, development, and optimisation of advanced PIC components - with a particular focus on state-of-the-art fiber-to-chip coupling and photonic packaging - driving solutions from initial concept through layout, fabrication, and production-ready integration.

As a technical lead for specific PIC components, you will drive innovation across the full photonic integration lifecycle, define design methodologies, and coordinate cross-functional teams from concept to production. Your expertise in fiber-to-chip coupling and packaging will directly distinguish Q.ANT’s photonic solutions and shape the company’s technology roadmap.

Location: Stuttgart, Germany
Type: Permanent employment, full-time
Work mode: Onsite with max. 1 day remote work per week

What You Will Do

• Drive the development of state-of-the-art fiber-to-chip coupling solutions for industry environments - driving mode matching, loss budget optimisation, and packaging integration from component design through production-ready delivery•     Lead the design, prototyping, and validation of specific photonic chip components - from concept through layout, tape-out coordination, fabrication, and packaging - ensuring all deliverables meet performance specifications and schedule targets
• Implement photonic computing architectures on chip; drive innovation and new technology development in the PIC domain, proposing novel components and integration strategies that feed directly into Q.ANT’s product and technology roadmap
• Coordinate cross-disciplinary engineering projects (design, development, integration, testing) from concept to production - working closely with packaging, test, and foundry teams; collect and consolidate specifications from stakeholders and translate them into circuit definitions
• Mentor junior engineers and technicians; provide technical guidance and ensure effective collaboration across all project phases
• Present complex technical findings and design decisions to both technical peers and executive-level stakeholders with clarity and precision

Your profile

Required:

• Strong academic foundation in Photonics, Electrical Engineering, Applied Physics, or a related field (Master’s degree or PhD); equivalent industry experience considered
• 3+ years of proven hands-on experience in photonic design, layout, and tape-out coordination
• In-depth expertise in fiber-to-chip coupling interfaces, including mode matching, packaging constraints, and loss budget management
• Advanced proficiency in photonic simulation tools (e.g., Lumerical/Ansys, RSoft, Photon Design Suite, or equivalent) with demonstrated ability to produce design-ready simulation outputs
• Solid practical experience with a PIC-specific layout tool (e.g., Nazca, GDSFactory, or Luceda) and advanced Python skills applied to photonic design workflows - automation, simulation scripting, and data analysis
• Solid grounding in optical device characterization techniques and interpretation of optical/electrical test data
• Proven ability to coordinate cross-functional technical investigations across teams without formal authority and strong communication skills at both technical and executive level
• Proven track record collecting and consolidating specifications from stakeholders and translating them into circuit definitions
• Fluent English; German is beneficial - working language in the team is English

Nice to have:
None of the following are required - they are genuine bonuses and we do not expect any one candidate to bring all of them:

• First experimental experience with TFLN / LNOI
• Understanding of AI or high-speed optical communication system requirements for PICs
• Knowledge of mixed-signal and photonic/electronic co-packaging challenges
• Experience with foundry collaboration and process transfer to external manufacturing partners

Why us?

• Make impact at scale: Your verification and integration work directly determines which PIC technologies are production-ready - high stakes, high impact from day one
• Work on the leading edge: Photonic integrated circuit technologies that are shaping the next decade of computing
• Own your work from day one: Shape characterization strategies, integration workflows, and roadmap inputs on your own, with direct impact on product success
• Fast-track your growth: Work on challenges with few industry precedents