Senior Director Hardware Engineer

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for passionate, high-energy engineers to help achieve that mission.  

As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. We are looking for seasoned engineering leaders with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure.   

We are looking for a Senior Director Hardware Engineer to work in the dynamic Microsoft Silicon Manufacturing Packaging Engineering team (SMPE). 

Responsibilities

• Drive next generation manufacturing development roadmaps to enable development, manufacturing, fabrication, testing, and packaging of Hyperscaler class semiconductor integrated circuits (ICs). 
• Work with diverse and talented set of engineering teams to develop the vision for next generation of Hyperscaler class semiconductor integrated circuits (ICs) and how to make them manufacturable with industry leading product cost to provide best in class platform cost of ownership. 
• Drive eco system partnerships to enable pre-Si and post-Si readiness for power, performance, Thermal and Power delivery related testing for industry best platform solutions – differentiating features that will provide cost and performance advantage.   
• Establish and grow external vendor relationships, drive cross functional teams and drive projects as part of larger development programs.   
• Have excellent knowledge of silicon development life cycle across foundry, packaging integration, assembly and test technologies with ability to cultivate industry partnerships to drive outcomes.
• Conduct industry competitive analysis to identify opportunities for developing cost-effective products.

Qualifications

Required/Minimum Qualifications 

• 11+ years of related technical engineering experience
  • OR Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience or internship experience
  • OR Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience or internship experience
  • OR Doctorate degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 5+ years technical engineering experience.
• 10+ years of experience in Product development and manufacturing in large scale and/or high performance (i.e., AI, machine leaning, neural nets, CPU’s) and/or high power SoCs/chips.   
• 10+ years of experience in Developing Integrated Circuits (pre-silicon, first silicon bring-up, new product introduction).   
• 8+ years of experience in product and test engineering, specializing in ATE test program development.