Head of AcuShape Software Development (3D Modeling)

Company Overview

KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen, VR device or smart car would have made it into your hands without us. KLA invents systems and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. The innovative ideas and devices that are advancing humanity all begin with inspiration, research and development. KLA focuses more than average on innovation and we invest 15% of sales back into R&D. Our expert teams of physicists, engineers, data scientists and problem-solvers work together with the world’s leading technology providers to accelerate the delivery of tomorrow’s electronic devices. Life here is exciting and our teams thrive on tackling really hard problems. There is never a dull moment with us.

Group/Division

With over 40 years of semiconductor process control experience, chipmakers around the globe rely on KLA to ensure that their fabs ramp next-generation devices to volume production quickly and cost-effectively. Enabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible for creating all of KLA’s metrology and inspection products, is looking for the best and the brightest research scientist, software engineers, application development engineers, and senior product technology process engineers. The Film and Scatterometry Technology (FaST) Division provides industry leading metrology solutions for worldwide semiconductor IC manufacturers. The FaST Division portfolio of metrology products includes hardware and software solutions for optical film thickness, optical critical dimension (CD), composition, and resistivity measurement systems. These products are essential for the IC manufacturers as they provide critical metrology capabilities for the development and implementation of their advanced IC processes. The FaST division is committed to support our customers to achieve performance entitlement of our solution and we effectively partner with our customers from their early research and development phase to the high volume in-line manufacturing implementation specific for their process needs. The division consists of a global team located in US, Israel, China, and India.

Job Description/Preferred Qualifications

Job Summary

KLA is seeking a strategic and technically strong leader to head the AcuShape Software Development team. This global team of approximately 30 engineers, located across Milpitas, CA, Ann Arbor, MI, and Shanghai China, develops advanced 3D modeling and analysis software. The software plays a critical role in visualizing semiconductor device structures using customer-provided references and data from KLA’s industry-leading metrology tools.

Key Responsibilities

• Lead the design, development, and deployment of 3D modeling and analysis software used in semiconductor metrology and process control

• Oversee the full software development lifecycle, ensuring timely delivery of high-quality, scalable, and maintainable solutions

• Collaborate with cross-functional teams including Algorithms, Applications, and Product Management to align on technical direction and product goals

• Drive adoption of modern development practices and tools, including AI-assisted coding and automation, to enhance team productivity and software quality

• Manage and optimize global team operations, including budgeting, forecasting, and resource allocation

• Foster a culture of innovation, continuous improvement, and technical excellence

• Mentor and develop engineering talent, set clear goals and support career growth

Preferred Qualifications

• 7+ years of experience in software development leadership roles

• Proven ability to lead and scale distributed engineering teams across multiple geographies

• Solid knowledge of advanced chip manufacturing processes strongly preferred, especially metrology and scatterometry techniques

• Experience leading software product development teams that design 3D modeling products, ideally related to electromagnetic waves, RCWA and device and material physics

• Strong project management skills, with experience in Agile and iterative development methodologies

• Deep understanding of modern software engineering practices, tools, and technologies

• Demonstrated success in driving innovation and operational efficiency

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