Senior Principal Electronics Packaging Engineer - Remote

Date Posted:

2025-09-12

Country:

United States of America

Location:

MA103: 555 Technology Square 555 Technology Square , Cambridge, MA, 02139 USA

Position Role Type:

Remote

U.S. Citizen, U.S. Person, or Immigration Status Requirements:

The ability to obtain and maintain a U.S. government issued security clearance is required.​ U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance

Security Clearance:

DoD Clearance: Secret

At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world. 

As a Senior Principal Electronics Packaging Engineer, you will work with other disciplines on both the internal and Customer Production and Design Integrated Product Teams (IPTs) to investigate Circuit Card Assembly (CCA) production failures while also supporting the development of new radiation-hardened CCA designs for military space applications.

Your work will include engineering unique packaging, fixturing, and tooling solutions, delivering development hardware, facilitating the delivery of production hardware, processing engineering changes to the production configuration, and support of fielded systems.

Production support will include working with other disciplines to root cause CCA test failures, including process, thermal analysis, structural analysis, and electrical design.

What you will do:

• Participate in and lead robust investigations into highly complex, open-ended issues to search for and identify root causes of non-conforming hardware.
• Identify and interface with Customer stakeholders and vendors on a regular (if not daily) basis.
• Create and present non-conformance reports to the Customer, providing recommendations for disposition, including defining/creating repair procedures and work instructions, as required.
• Lead the design and development of complex electronics packaging solutions with minimal oversight.
• Create part models and drawings for CCA-level packaging, fixturing, and tooling.
• Work with vendors to support process and product quality improvements.
• Generate development of hardware designs that meet objectives and facilitate the delivery of the hardware on schedule.
• Interface with a cross functional team, such as Electrical and Systems engineering, to deliver development and production hardware with assured compliance to requirements throughout the entirety of a product’s lifecycle.
• Communicate technical topics and issues in a clear and concise manner to both technical peers as well as non-technical team members.
• Conduct and provide constructive feedback during peer reviews. Mentor and document knowledge to provide technical guidance to both members of own team and beyond.

Qualifications You Must Have:

• Typically requires a Bachelors degree in Science, Technology, Engineering or Mathematics (STEM) and minimum 10 years prior relevant experience
• Experience with direct external customer interface at the senior engineering level.  
• Experience with 3D CAD software (Creo, SolidWorks, or similar)
• Experience with project management.

Qualifications We Value:

• At least 10 years of experience on one or more DoD programs delivering mission-assured, hostile radiation survivable components, subsystems, and/or systems for space.
• Excellent written and verbal communication skills. Ability to present ideas to senior level stakeholders
• Practical experience in design and thermal management techniques for electronics packaging designs with rigorous size, weight, and power (SWaP) requirements.
• Hands-on experience designing to meet and qualifying products for rugged environments such as those with electromagnetic interference (EMI), electromagnetic pulse (EMP), and nuclear exposure.
• Experience with schematic capture tools (Expedition, etc.).
• Working experience with thermal/structural analysis of CCAs, PWBs, and frames.
• Direct experience with printed circuit board (PCB) designs. Can support tasks not directly mechanical such as component selection and layout to ensure mechanical environmental considerations are met.
• Experience with rapid prototyping process methods, such as 3D printing, for mid-stream design verifications.

What We Offer:

• Our values drive