Sr. Mechanical Design Engineer, Battery Electronics Packaging

Supernal is at the forefront of creating emerging mobility solutions that will foster the development of human-centered cities. We are designing a completely new electric vertical take-off and landing (eVTOL) aircraft tailored to the mobility needs of future cities. This allows passengers a seamless intermodal journey that safely transports them to their final destination. We fuse research in autonomy, robotics, aviation and services to define a new category of mobility for the world’s communities. We believe in creative thinking and collaboration to help build a better mobility experience for everyone, improving people’s ability to move – whether for work or play.

What we do:

The Battery Pack Team is responsible for designing and prototyping high-voltage and high-power battery systems in electrified aircraft. The electronics packaging engineer for battery pack design is critical to the Energy Storage System (ESS) development process, including conceptual designs, components selection, prototype builds, and launch designs for volume manufacture.

The Sr. Mechanical Design Engineer, Battery Electronics Packaging, will design the mechanical aspects of electrical components and their packaging. The Electric Vertical Take-Off and Landing (EVTOL contains high-voltage printed circuit boards, flex circuits, cable harnesses, laminated bus bars, and sense circuits. The main responsibility of this role will be to plan and ensure the protection of these electronic components in the Supernal battery pack designs.

This position will be required to work on-site 5 days a week.

What you can do:

• Drive mechanical design of electrical components, interconnects, and electromechanical subsystem designs from conceptual and requirements development through production
• Select, prove, and implement the application of existing technologies to internal product development and develop new technologies to improve product metrics; for electromechanical components, this may include interconnects (solder bonds, welds, ribbon bonds, connectors, terminal lugs, spring fingers, etc.) and packaging interfaces (PCBA layup, flex layup, layout, vias, bolted mounts, heat stakes, over molding, snap fits, thermal interface materials, heat sink interfaces, harness insulation, shielding, strain relief, and cable management, etc)
• Provide technical expertise and mentorship to the team in electronics packaging and mechanical design of electronic components, such as wire harnesses, flexible printed circuit boards, connectors, laminated bus bars, and voltage, current, and temperature sense technologies
• Define specifications pertaining to electronic components (dimensional and dielectric, functional, performance, reliability, survivability, component manufacturing, and interface manufacturing
• Perform fundamental prototyping, testing, and analysis tasks and provide assistance for advanced analysis and validation testing
• Identify the root cause of issues in prototype, validation, and production stages and help in finding solutions for them
• Communicate work progress to department leadership through written and live updates, representing both individual and team efforts
• Collaborate with teams at Supernal sites and meet with suppliers for technology development, process validation, and issue resolution
• Build relationships with critical multi-functional teams in electrical design, testing, safety, abuse, manufacturing, systems, certification, and airframes
• Partner with PMO organization to implement build plan
• Up to 10% of domestic and international travel
• Other duties as assigned

What you can contribute:

• Bachelor’s degree in mechanical engineering or relevant engineering field required; Dual degrees in mechanical and electrical engineering preferred
• Minimum of five (5) years of experience in electromechanical component and subsystem design (an equivalent combination of education and experience may be considered)
• Experience designing electronic components: wire harnesses, connectors, flex printed circuit boards, laminated bus bars, voltage, current, and temperature sense circuits
• Experience designing for volume assembly, including manual and automated processes
• Ability to package electronics to achieve mass, thermal performance, sealing requirements, electrical grounding behavior, mechanical durability
• Knowledge of mechanical design fundamentals, electronic component materials, metallurgy, plating, interconnects, composites, harnesses, connectors, construction, thermal interface materials, dielectric materials, sealing methods
• Ability to translate product requirements into system and subsystem requirements
• Ability to translate subsystem requirements to part requirements and