LTAMDS Task Lead

Date Posted:

2024-09-27

Country:

United States of America

Location:

MA131: Tewksbury, MA Bldg 1 Assabet 50 Apple Hill Drive Assabet - Building 1, Tewksbury, MA, 01876 USA

Position Role Type:

Onsite

At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world.

The Task Lead (Sub-IPT) reports to the LTAMDS Array IPT Lead. The LTAMDS program is a multiple year, multiple customer program that will be ramping up in production. The Sub-IPT lead will own one or more RF products and be responsible for execution of hardware delivery to the Array. This will include oversite of material delivery, build, and test. The work will involve support in the IADC facility as well as suppliers (as needed). CONUS And OCONUS travel will be required under 10% of the time. This role involves understanding of EVMS and MS project planning. This role involves cross functional collaboration and basic understanding of module level RF test, Near Field Range & Far Field range testing.

Tasks include supporting development or production, leading proposal activities, and technical management of both engineering disciplines and suppliers for programs throughout the product life cycle.

Successful candidate will be a self-starter with proven project organization and execution skills, multi-tasking and verbal/written communication and presentation skills, and experience in a budget and schedule critical environment. Candidates should lead multi-discipline teams to develop systems from concept through integration and production, and develop solutions to a variety of technical problems of large scope and complexity. A candidate willing to collaborate and coordinate with Operations, Supply Chain, Quality, and other Engineering disciplines to resolve issues. Qualified candidates must have experience with digital, analog and/or RF testing and experience debugging complex circuit card assemblies or electro-mechanical systems. Knowledge of RF / microwave devices preferred.

What You Will Do

• Lead others by understanding team dynamics and capitalizing on diverse team strengths while mitigating gaps
• Lead trade studies to determine the best solution and plan forward for solving complex problems while considering quality, cost, schedule, and performance
• Regularly convey task status on complex issues and strategic plans across multiple teams, program, department, and customer leadership
• Seek opportunities to fill any role necessary to help ensure business unit success
• Partner with the program team to ensure cost, schedule, and technical requirements are fully integrated and executed as planned

Qualifications You Must Have

• Typically requires a Bachelor’s in Science, Technology, Engineering, or Mathematics (STEM)
• Minimum of 5 years of engineering experience with progressing leadership roles
• Experience with any of the following as it relates to electrical subsystems and/or circuit card assembly: 
  • Development
  • Integration 
  • Test
  • Production support
• Experience with analog, digital and/or mixed signal circuit design/analysis or hardware integration/test
• The ability to obtain and maintain a US security clearance prior to the start date. U.S. citizenship is required as only U.S. citizens are eligible for a security clearance

Qualifications We Value

• Experience in the design, test and sell off of military systems
• Demonstrated ability to work with a complex engineering team
• Solid understanding of hardware testing methodologies
• Experience in Root-Cause Corrective Action investigations and FRACAS processes
• Knowledge and experience with Material Review Board, Process Configuration Board, Configuration Control Board and Failure Review Board processes, proposing/defending and implementing Change Notices
• Experience in resolving production issues with suppliers and sub-tier suppliers
• A minimum of 6 years of experience in the assembly, integration and test of EO and RF subsystems
• Mentor Graphics DxDesigner experience and command of circuit simulation and analysis tools such as PSPICE, System Vision
• Knowledge of printed circuit board fabrication and circuit card assembly processes and related industry specifications
• Familiarity with missile communication transceivers and data links, IR or RF sensors, inertial measurement units (IMU) and Global Positioning S