Principal Process Engineer -Thin Films

Experience TSMC Washington where technology leaders are constantly innovating, manufacturing to perfection, and collaborating with customers to achieve greatness. Witness the action-packed team in motion as they strive to maintain their position at the forefront of the industry. 

We are currently seeking a highly motivated Principal Process Engineer with a strong technical background to join our Thin Film Department. As the Principal Process Engineer , you will be responsible for sustaining and continuously improving our manufacturing process. In this role, you will be required to multitask and work efficiently in a fast-paced semiconductor environment. Your daily duties will involve process sustaining and troubleshooting, ensuring that all equipment is operating at its optimal level.

The ideal candidate will possess excellent communication skills and be able to work collaboratively with cross-functional teams. If you are a self-starter with a passion for process improvement and have experience in the semiconductor industry, we encourage you to apply for this exciting opportunity.

While this position is scheduled to work core business hours, Monday-Friday, there may be times when additional hours are necessary.

 Responsibilities include: 

• Work closely with manufacture, process and equipment engineers to achieve fab moves requirement and miantain operation line.
• Daily process sustaining, including E-muc recovery, maintain in-line/off-line monitor performance to make sure stable process/ good quality on wafers processed and outlier tool issue resolved.
• Proactively apply “Stop and Fix” when seeing signals to prevent more wafers impacted by a potential event.
• Keep escalating system weakness or chronic issue for owners to follow up for continuous improvement.

Requirements: 

• All applicants must possess legal authorization to work for any employer in the United States, and the employer cannot provide sponsorship or take over sponsorship of an employment visa at this time.
• 3-5 years and above relevant experience in semiconductor fab in Thin Film area.
• Excellent oral and written communication and computer skills including MS Office & Windows.
• High AQ (Adversity Quotient) to accept challenges from work.
• Detail oriented and self-motivated individual with good ownership.
• Open minded team player and willing to take challenges.
• Data and goal driven mindset.
• Familiar with Poseidon Fab operation system, SPC, EMS and RMS.
• Familiar with CVD/PVD process and tool platform including AMAT-Centura/HDP/RTA/Endura/CVD_TIN/WCVD and NVLS-Altus/Sequal.

Physical Requirement:

• Ability to spend majority of shift on feet, both walking and standing, with occasional sitting.
• Frequent coordinated use of hands.
• Lift and or carry up to 56 pounds.
• Pushing or pulling 66 pounds.
• Occasionally reach, bend forward while standing, or squat.

Eligibility: 

• All applicants must possess legal authorization to work in the United States. Please note that we are unable to provide sponsorship or take over sponsorship of an employment visa at this time.
• To be eligible for employment at TSMC, candidates must successfully pass a background check and a drug screening. Please note, in compliance with Washington state regulations, the drug screen will not test for cannabis (marijuana) use.
   

Work Location & Schedule: 

This position operates on-site at our Camas, Washington location during core business hours, Monday through Friday 8 am – 5 pm; however, there may be occasions when additional hours are necessary to meet project demands.

Total Rewards

Pay Transparency & Other Compensation

At TSMC, your base pay is just one component of your comprehensive compensation package. For new hires in this position, the starting salary typically ranges between $88,672.00 and $121,923.00 per year. The full salary range for this Job Grade extends from $88,672.00 - $133,008.00 depending on factors such as skills, qualifications, education, experience, tenure, and position level. TSMC’