Director of Advanced IC Packaging Development

Job Description

Renesas is seeking a Director of Advanced IC Packaging Development to lead the Next Generation Power Packaging roadmap. This role is pivotal in enabling the AI and Datacenter revolution by developing cutting-edge Smart Power Stages, Vertical Power Stages, and Wide Bandgap (SiC/GaN) solutions. You will oversee the entire lifecycle from R&D and NPI to high-volume global OSAT management, ensuring Renesas remains at the forefront of power density and thermal efficiency.

Responsibilities: 

1. Technology Roadmap & R&D Strategy

• Define and execute the global packaging roadmap, focusing on Power SiP/Modules, Wafer Level Packaging, and Flip-Chip technologies.
• Lead R&D initiatives for Wide Bandgap (SiC & GaN) power devices, utilizing advanced substrates like DBC (Direct Bonded Copper) and AMB (Active Metal Brazing).
• Manage the annual R&D budget and oversee customer adoption programs to align technical capabilities with market demand.
• Establish and maintain corporate package design rules to ensure manufacturability and reliability

2. Global OSAT & Supply Chain Management

• Benchmark, select, and qualify global OSATs and Contract Manufacturers (CM) for new package technologies.
• Drive DOE (Design of Experiments) with partners to optimize assembly processes and establish rigorous process specifications.
• Monitor production early in the ramp phase to resolve integration issues and ensure superior quality.

3. NPI, Qualification & Quality Control

• Lead the transition of new products from R&D to High Volume Manufacturing (HVM).
• Collaborate with Product and Reliability teams to qualify new packages within aggressive timeframes.
• Resolve process integration bottlenecks by ensuring exhaustive window checks on critical process steps.
• Implement SPC (Statistical Process Control) and production monitors to prevent quality incidents and excursions.

4. Cross-Functional Leadership

• Act as the technical authority for internal and external customer complaints, working with Marketing, Quality, and Operations to provide root-cause analysis and resolutions.
• Maintain a competitive edge by staying current on industry innovations in interconnect methods (Wire-bonding, Multi-chip modules, etc.).

Qualifications

• Education: Doctorate, Master’s, or Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical, or Materials Engineering.
• Experience: 15 to 20 years of relevant experience in semiconductor package development, specifically emphasizing power SIP/modules and wafer level & flip-chip packaging.
• Deep knowledge of Power SiP/Modules, Flip-Chip, and Wafer Level assembly.
• Familiarity with Smart Power Stages and Vertical Power architectures.
• Expertise in SPC, statistical analysis software, and qualification methods.
• Exceptional interpersonal, presentation, analytical and communication skills

Additional Information

The expected annual pay range for this position is $200K - $250K. This position is also eligible for bonus opportunities. Please note that final offer amount will be dependent on geographic location, applicable experience, and skillset of the candidate.

Renesas offers a full range of elective benefits including medical, health savings account (with applicable medical plan), dental, vision, health and/or dependent care flexible spending accounts, pre-tax commuter benefits, life insurance, AD&D, and pet insurance. In addition to elective benefit options, benefited employees receive company-paid life insurance and AD&D, LTD, short term medical benefits as well as paid sick time, paid holidays, and accrued paid vacation. New employees will attend a detailed benefit orientation to learn more about our many benefits and resources.

Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.
 
With a diverse team of over 22,000 professionals in more than 30 countries, we continue to expand our boundaries