New College Grad - Engineer, Thin Films Equipment

Responsibilities And Tasks

• Establish and improve equipment condition and technology by leveraging data analytics and AI-driven insights to proactively identify performance gaps and optimize tool health

• Upgrade process capability and reduce production cost using AI-enabled process monitoring, predictive maintenance models, and advanced data analysis techniques

• Establish and modify process management projects, incorporating AI-based solutions, digital twins, and automation tools to enhance efficiency and scalability

• Set up and optimize process parameters for a variety of semiconductor equipment using statistical modeling, machine learning techniques, and run-to-run (R2R) data optimization strategies

• Lead evaluation, promotion, and planning of new equipment and materials, including assessment of AI readiness, automation capabilities, and integration with smart manufacturing systems

• Perform abnormal analysis and continuous improvement by applying AI-assisted root cause analysis, pattern recognition, and anomaly detection tools to enable faster and more accurate issue resolution

• Utilize enterprise data platforms and AI tools (e.g., dashboards, predictive analytics systems) to drive data-informed decision-making and continuous operational improvement

• Collaborate across engineering, manufacturing, and data science teams to implement AI-enabled ways of working and support Micron’s digital transformation initiatives

Minimum Qualifications

• Bachelor’s degree in Engineering (Mechanical, Electrical, Chemical, Materials Science, or related field)

• Knowledge of Mechanical, Electrical, Chemical Systems and troubleshooting

• Demonstrated ability to analyze problems and clearly communicate technical solutions and status

• Basic understanding of semiconductor manufacturing processes or equipment through coursework, internships, or co-op experience

• Strong willingness to learn, adapt, and work in a fast-paced, high-volume manufacturing environment

• Ability to follow detailed procedures (SOPs, PM checklists) with high attention to safety and quality

• Effective written and verbal communication skills with the ability to work in team-based environments

Preferred Qualifications

• Prior experience with OEM platforms (AMAT, LAM, TEL, ULVAC, Canon) or similar thin film toolsets

• Experience in high-volume manufacturing (HVM) semiconductor fabs

• Demonstrated leadership or ownership of tools, projects, or small teams

• Experience with tool installs, upgrades, copy-exact transfers, or reliability improvement initiatives

• Strong collaboration and communication skills across shift teams, engineering, and process groups