Staff Design Engineer

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.

 

Are you ready to shape the future of Wi-Fi connectivity? Qorvo's Connectivity Components Business Unit (CCBU) develops advanced Wi-Fi and IoT Front End solutions that boost wireless connectivity in homes, enterprises and smartphones. Our innovative products, including Wi-Fi and IoT FEMs, iFEMs and filters, enable faster downloads and seamless multi-device connections without performance loss. Be part of the team that develops products and solutions that are driving the future of IoT/CIoT and all Wi-Fi standards.

CCBU is part of the Connectivity & Sensors Group (CSG) at Qorvo.  CSG is a leading global supplier of connectivity systems and components, including Ultra-Wideband, Bluetooth, Matter, Wi-Fi, cellular IoT and MEMS sensors. Markets for CSG include smart home, automotive connectivity, industrial automation, smartphones, wearables, gaming and other high-growth IoT connectivity and healthcare market segments.

 

OVERVIEW:

We are looking for a motivated Staff Laminate/Module Design Engineer to join our Connectivity Components Business Unit (CCBU).  Reporting to Design Engineering Management, the Design Engineer will be responsible for the laminate/module designs of RF front-end modules for Wi-Fi applications. The Design Engineer will help drive engineering decisions and lead the design and development of module layout and floor planning, laminate design, module integration, and simulation for Wi-Fi RF front-end modules that include linear and/or non-linear power amplifiers (PAs), Low Noise Amplifiers (LNAs), switches, and filters. The Design Engineer will work closely with a core design engineering team and other cross-functional team members to bring cutting edge Wi-Fi products to the market.

 

KEY RESPONSIBILITIES:

• Create detailed, module-level laminate designs for next generation Wi-Fi RF front-end modules that include power amplifiers, low-noise amplifiers, switches, and/or filters for 2.4GHz, 5GHz, 6GHz, and/or 5-7GHz Wi-Fi applications.
• Collaborate with Engineering and Marketing Managers to define product requirements.
• Determine design approaches targeting key module parameter specifications.
• Lead module and/or laminate design reviews, including assembly specifications and/or requirements.
• Assist with hands-on laboratory work including testing, RF tuning, and data analysis.
• Create and execute product development plans including design, simulation, layout, and verification testing.
• Provide product development support for RF front-end modules targeting 2.4GHz, 5GHz, 6GHz, and/or 5-7GHz Wi-Fi applications.
• Collaborate with cross-functional team members to bring products from conception to full production release.
• Identify and address design risks and challenges to meet performance metrics.
• Support Product Marketing and Applications Engineering throughout the product development lifecycle with product prototypes and samples, data and design summaries, and application circuit recommendations.

 

QUALIFICATIONS:

• A minimum of a Bachelor’s degree in an Electrical Engineering discipline, Master’s degree or higher preferred
• A minimum of 12 years of RF industry experience, with previous Module design experience preferred
• Proficient with RFIC and module EDA tools (Keysight ADS and/or Cadence) to design and simulate RF multi-chip modules
• Proficient with EM simulator tools (ADS Momentum or FEM, Cadence EMX, and/or Ansyss HFSS) to design and simulate RF multi-chip modules
• History of successfully designing and production-releasing state-of-the art front-end modules that incorporate RFIC designs in GaAs, GaN, SiGe, RF CMOS, and/or SOI technologies
• Prior experience