Process Engineering Intern

Qorvo is All Around You! We manufacture innovative RF solutions at the center of connectivity to enable high-performance applications for advanced wireless devices, wired and wireless networks and defense radar and communications for 5G networks, cloud computing, the Internet of Things, and other emerging applications. We are a global company thriving on a culture of innovation, diversity, and inclusion. Our people are always at the core of Qorvo’s innovation. Qorvo is a place to stretch your imagination and push boundaries to achieve success. Learn more about Top 10 Reasons to make a career at Qorvo.

 

Qorvo’s Internship Program is designed for college students currently enrolled in an accredited Bachelor’s, Master’s, or PhD program. Qorvo offers real work experience, exposure to upper management, and the opportunity to pursue full time opportunities, as available.

 

 Qorvo’s Internship Program offers:

 

• Challenging, skill-building assignments.
• Mentoring and coaching from industry experts.
• Lunch & learns and other learning opportunities.
• Collaborative team-based work environment.
• Networking and social events.
• Final presentation to business leaders.

 

Qorvo’s Process Engineering Internships are offered in our Global Operations team which develops the process technology to create the products for our High-Performance Analog, Advanced Cellular, and Connectivity and Sensors business groups. The positions will span the range of technologies from BAW, SAW, GaAs, GaN and sensor technologies. Specific projects and responsibilities will be determined based on the business needs at the time of the internship assignment.

 

Responsibilities may include:

 

• Ability and willingness to work in a semiconductor clean room environment.
• Learn and conduct development activities on process equipment.
• Data collection via various metrology tools.
• Data analysis using software such as JMP, Spotfire, or Excel.
• Process troubleshooting and recipe optimization.
• Experimental design and execution of a fab engineering trial.
• One or more projects in areas involving Evaporation, CVD, PVD, thin film depositing, Electroplating, plasma etch, Dry/Wet Etch, Photolithography, Wafer Dicing, CMP etc.

 

Qualifications:

 

• Currently pursuing a BS, MS, PhD in Electrical Engineering, Chemical Engineering, Materials Science, or related fields, Minimum 3.0 GPA.
• Semiconductor coursework and/or experience, including standard processing techniques (PVD, CVD, lithography, dry/wet etch, CMP).
• Willingness for “hands on” engineering work in a clean room facility.
• Proficiency with Microsoft Office (Excel, Word, PowerPoint).