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Senior Lead Engineer for Advanced Packaging
HRL LaboratoriesUnited Statesfull_timeVerifiedPosted 10 May 2023
💰 $264,000/yr($159,000/yr – $264,000/yr)
About the role
Based in Southern California with locations in Malibu, Calabasas and Camarillo; HRL has been on the leading edge of technology, conducting pioneering research and advancing the state of the art.
The Mixed Signal Solutions department at HRL Laboratories is a highly talented team of scientists and engineers with diverse backgrounds in integrated circuit design, advanced packaging and integration, novel signal processing and algorithm development, and integration / characterization of highly complex digital and mixed signal systems and subsystems for commercial and government applications in an innovative research and development environment. We seek an experienced candidate capable of technical and programmatic leadership of several R&D efforts focused on development, demonstration, and maturation of novel 2.5D and 3D semiconductor integration processes for dense high-speed mixed-signal electronics applications.
Essential Duties:The successful candidate will enable revolutionary development of novel 2.5D and 3D semiconductor integration processes for dense high speed mixed signal electronics applications, with attention to all facets of this endeavor (e.g. RF electrical performance of both passive and active components, thermal-mechanical constraints, chemical / metallurgical issues, manufacturability/cost constraints, etc.). This Lead Engineer role will require attention to tradeoffs involving all facets of integration from chip-level integration (e.g. die and wafer stacking, WLFO) to package and PCB. Must organize and manage research and development projects to be carried out by technical teams of other domain experts (e.g. in each of the technical areas mentioned above). Must provide mentorship and guidance to others in all aspects of these projects (technical, organization, reporting, etc.). Must develop and maintain relationships with relevant vendors and partner organizations, as well as with other internal leads and teams working on other system elements. Must have excellent communications skills, organizing and presenting results in written reports and oral presentations. Must create and manage work plans to meet or exceed schedule deadlines and technical expectations. Must lead and contribute to proposal and marketing efforts required to sustain continued R&D efforts.
Required Skills:More than 15 years of experience in developing, characterizing, and exercising semiconductor manufacturing processes and corresponding electronics packaging. More than 15 years of experience with design of experiments and analysis techniques (electrical, mechanical, thermal, chemical, etc.) needed to develop and assess new process tools and techniques. Demonstrated experience developing external partnerships and vendor relationships. Several years of experience in organizing and leading technical research and development efforts, and in preparing presentations and proposals needed to attract research funding. Familiarity with commercial packaging technology (e.g. ceramic and laminate chip-level packages, printed circuit boards, interposers, etc.) and integrated circuit processing and integration techniques.
Basic background knowledge across all domains relevant to mixed signal systems (e.g. thermal-mechanical design, integrated circuit design, semiconductor processing and associated material science, control system theory, etc.) with deeper understanding of material science, surface chemistry, semiconductor physics, and thermal/mechanical theory related to electronics processing and assembly techniques. Familiarity with high-speed electrical characterization methods. Familiarity with standard system engineering practices and terminology. Proficiency in use of computers, engineering work stations, complex electronic equipment, oral and written communication, interaction with vendors/colleagues and willingness to work in a fast-paced, deadline-driven environment. Ability to work well in a team and independently. Use of Microsoft Office tools (Word, Excel, Powerpoint) and proficiency in writing for reporting.
Physical Requirements:Must be sufficiently mobile to work within confined spaces and have both visual and hearing acuity.
Required Education:Ph.D. in Material Science, Physics, Physical Chemistry, or related scientific discipline.
Special Requirements:Must be able to obtain and maintain a security clearance. Active SSBI is a plus.
Compensation:The base salary range for this full-time position is $159,000 - $264,000 + bonus + benefits. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries for the position. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more abo
The Mixed Signal Solutions department at HRL Laboratories is a highly talented team of scientists and engineers with diverse backgrounds in integrated circuit design, advanced packaging and integration, novel signal processing and algorithm development, and integration / characterization of highly complex digital and mixed signal systems and subsystems for commercial and government applications in an innovative research and development environment. We seek an experienced candidate capable of technical and programmatic leadership of several R&D efforts focused on development, demonstration, and maturation of novel 2.5D and 3D semiconductor integration processes for dense high-speed mixed-signal electronics applications.
Essential Duties:The successful candidate will enable revolutionary development of novel 2.5D and 3D semiconductor integration processes for dense high speed mixed signal electronics applications, with attention to all facets of this endeavor (e.g. RF electrical performance of both passive and active components, thermal-mechanical constraints, chemical / metallurgical issues, manufacturability/cost constraints, etc.). This Lead Engineer role will require attention to tradeoffs involving all facets of integration from chip-level integration (e.g. die and wafer stacking, WLFO) to package and PCB. Must organize and manage research and development projects to be carried out by technical teams of other domain experts (e.g. in each of the technical areas mentioned above). Must provide mentorship and guidance to others in all aspects of these projects (technical, organization, reporting, etc.). Must develop and maintain relationships with relevant vendors and partner organizations, as well as with other internal leads and teams working on other system elements. Must have excellent communications skills, organizing and presenting results in written reports and oral presentations. Must create and manage work plans to meet or exceed schedule deadlines and technical expectations. Must lead and contribute to proposal and marketing efforts required to sustain continued R&D efforts.
Required Skills:More than 15 years of experience in developing, characterizing, and exercising semiconductor manufacturing processes and corresponding electronics packaging. More than 15 years of experience with design of experiments and analysis techniques (electrical, mechanical, thermal, chemical, etc.) needed to develop and assess new process tools and techniques. Demonstrated experience developing external partnerships and vendor relationships. Several years of experience in organizing and leading technical research and development efforts, and in preparing presentations and proposals needed to attract research funding. Familiarity with commercial packaging technology (e.g. ceramic and laminate chip-level packages, printed circuit boards, interposers, etc.) and integrated circuit processing and integration techniques.
Basic background knowledge across all domains relevant to mixed signal systems (e.g. thermal-mechanical design, integrated circuit design, semiconductor processing and associated material science, control system theory, etc.) with deeper understanding of material science, surface chemistry, semiconductor physics, and thermal/mechanical theory related to electronics processing and assembly techniques. Familiarity with high-speed electrical characterization methods. Familiarity with standard system engineering practices and terminology. Proficiency in use of computers, engineering work stations, complex electronic equipment, oral and written communication, interaction with vendors/colleagues and willingness to work in a fast-paced, deadline-driven environment. Ability to work well in a team and independently. Use of Microsoft Office tools (Word, Excel, Powerpoint) and proficiency in writing for reporting.
Physical Requirements:Must be sufficiently mobile to work within confined spaces and have both visual and hearing acuity.
Required Education:Ph.D. in Material Science, Physics, Physical Chemistry, or related scientific discipline.
Special Requirements:Must be able to obtain and maintain a security clearance. Active SSBI is a plus.
Compensation:The base salary range for this full-time position is $159,000 - $264,000 + bonus + benefits. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries for the position. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more abo
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